Electric field and temperature scaling of polarization reversal in silicon doped hafnium oxide ferroelectric thin films

Dayu Zhou,Yan Guan,Melvin M. Vopson,Jin Xu,Hailong Liang,Fei Cao,Xianlin Dong,Johannes Mueller,Tony Schenk,Uwe Schroeder
DOI: https://doi.org/10.1016/j.actamat.2015.07.035
IF: 9.4
2015-10-01
Acta Materialia
Abstract:HfO2-based binary lead-free ferroelectrics show promising properties for non-volatile memory applications, providing that their polarization reversal behavior is fully understood. In this work, temperature-dependent polarization hysteresis measured over a wide applied field range has been investigated for Si-doped HfO2 ferroelectric thin films. Our study indicates that in the low and medium electric field regimes (E<twofold coercive field, 2Ec), the reversal process is dominated by the thermal activation on domain wall motion and domain nucleation; while in the high-field regime (E>2Ec), a non-equilibrium nucleation-limited-switching mechanism dominates the reversal process. The optimum field for ferroelectric random access memory (FeRAM) applications was determined to be around 2.0MV/cm, which translates into a 2.0V potential applied across the 10nm thick films.
materials science, multidisciplinary,metallurgy & metallurgical engineering
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