Effects of Oxygen Plasma Power on Electrical Characteristics in Multi-Stacked Indium Zinc Oxide Transistors

Fei Shan,Jae-Yun Lee,Han-Sang Kim,Hao-Zhou Sun,Seong Gon Choi,Kwan-Jun Heo,Jung-Hyuk Koh,Sung-Jin Kim
DOI: https://doi.org/10.1007/s13391-021-00274-z
IF: 3.151
2021-02-26
Electronic Materials Letters
Abstract:<span class="a-plus-plus abstract-section id-a-sec1 outputmedium-all"><p class="a-plus-plus">We report on a method for fabricating solution-processed triple-multi-stacked indium zinc oxide (IZO) thin-film transistors (TFTs) at a low annealing temperature using an oxygen plasma treatment technique at different RF power levels of 120 W, 150 W, 180 W, and 210 W. The oxygen plasma post-treatment is an additional process to optimize the surface state of IZO films and to improve the electrical performance of the TFT device after using a low-temperature solution process instead of a high-temperature annealing process. The plasma-treated TFT device exhibits improved electrical performance, with mobility of 5.1 ± 0.5 cm<sup class="a-plus-plus">2</sup>/Vs, an <em class="a-plus-plus">on/off</em> ratio of 2.5 × 10<sup class="a-plus-plus">8</sup>, a threshold voltage of 2.6 ± 1.3 V, and a subthreshold swing of 0.6 ± 0.1 V/dec when the RF power is 150 W. Therefore, the multi-stacked activity structure and the low RF power plasma post-treatment process provides a simple and efficient fabrication method that reduces the processing temperature, improves the electrical properties, and can be widely used in flexible electronic devices.</p></span><span class="a-plus-plus abstract-section id-a-sec2 outputmedium-all"><h3 class="a-plus-plus">Graphic </h3><p class="a-plus-plus">Schematic diagrams of the multi-stacked IZO TFT structure, and the oxygen plasmaradiation process with variation of oxygen vacancy before and after treatment.</p></span>
materials science, multidisciplinary
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