A 3D Packaging Technology for 4 Gbit Stacked DRAM with 3 Gbps Data Transfer

Y. Kurita,O. Kato,M. Ishino,K. Soejima,S. Uchiyama,T. Mitsuhashi,N. Takahashi,M. Komuro,M. Kawano,K. Shibata,H. Ikeda,H. Kikuchi,J. Yamada,Y. Saeki,S. Matsui,Y. Egawa
DOI: https://doi.org/10.1109/IEDM.2006.346849
2006-12-01
Abstract:A 3D packaging technology has been developed for 4 Gbit DRAM. Highly-doped poly-Si through-silicon vias (TSVs) are used for vertical traces inside silicon and interconnection between DRAM chips to realize a DRAM compatible process. Through optimization of the process conditions and layout design, fast poly-Si filling has been obtained. The entire packaging was carried out at the wafer level by using the so-called SMAFTI technology. A new bump and wiring structure for feedthrough interposer (FTI) has also been developed for fine-pitch and low-cost bonding. Simulation of the transfer function of FTI wiring indicated a 3 Gbps/pin data transfer capability
Computer Science,Engineering,Materials Science
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