Abstract:Two-dimensional (2D) materials assembled into van der Waals (vdW) heterostructures contain unlimited combinations of mechanical, optical, and electrical properties that can be harnessed for potential device applications. Critically, these structures require control over interfacial adhesion for enabling their construction and have enough integrity to survive industrial fabrication processes upon their integration. Here, we promptly determine the adhesion quality of various exfoliated 2D materials on conventional SiO 2 /Si substrates using ultrasonic delamination threshold testing. This test allows us to quickly infer relative substrate adhesion based on the percent area of 2D flakes that survive a fixed time in an ultrasonic bath, allowing for control over process parameters that yield high or poor adhesion. We leverage this control of adhesion to optimize the vdW heterostructure assembly process, where we show that samples with high or low substrate adhesion relative to each other can be used selectively to construct high-throughput vdW stacks. Instead of tuning the adhesion of polymer stamps to 2D materials with constant 2D-substrate adhesion, we tune the 2D-substrate adhesion with constant stamp adhesion to 2D materials. The polymer stamps may be reused without any polymer melting steps, thus avoiding high temperatures (<120 °C) and allowing for high-throughput production. We show that this procedure can be used to create high-quality 2D twisted bilayer graphene on SiO 2 /Si, characterized with atomic force microscopy and Raman spectroscopic mapping, as well as low-angle twisted bilayer WSe 2 on h-BN/SiO 2 /Si, where we show direct real-space visualization of moiré reconstruction with tilt-angle dependent scanning electron microscopy.

Clean assembly of van der Waals heterostructures using silicon nitride membranes

Ultra-clean assembly of van der Waals heterostructures

Suspended dry pick-up and flip-over assembly for van der Waals heterostructures with ultra-clean surfaces

Heated Assembly and Transfer of Van der Waals Heterostructures with Common Nail Polish

Reliable Postprocessing Improvement of van der Waals Heterostructures

The hot pick-up technique for batch assembly of van der Waals heterostructures

Deterministic Assembly of Flexible Si/Ge Nanoribbons Via Edge-Cutting Transfer and Printing for Van Der Waals Heterojunctions.

Graphene Buffer Layer on SiC as a Release Layer for High-Quality Freestanding Semiconductor Membranes

Van Der Waals Nanomesh Electronics on Arbitrary Surfaces

Scalable heterostructures produced through mechanical abrasion of van der Waals powders

Cooperative Bilayer of Lattice-Disordered Nanoparticles As Room-Temperature Sinterable Nanoarchitecture for Device Integrations.

Controlled Preparation of High Quality Bubble-Free and Uniform Conducting Interfaces of Vertical Van Der Waals Heterostructures of Arrays.

Tailored 1D/2D Van der Waals Heterostructures for Unified Analog and Digital Electronics

Pick-up and assembling of chemically sensitive van der Waals heterostructures using dry cryogenic exfoliation

Ultrasonic delamination based adhesion testing for high-throughput assembly of van der Waals heterostructures

Van der Waals Self-Assembled Silica-Nanosphere/Graphene Buffer Layer for High-Quality Gallium Nitride Growth

Observing Imperfection in Atomic Interfaces for van der Waals Heterostructures

Optomechanical characterization of silicon nitride membrane arrays

Optimization of Mechanically Assembled Van Der Waals Heterostructure Based On Solution Immersion and Hot Plate Heating

Nano-ironing van der Waals Heterostructures Towards Electrically Controlled Quantum Dots