Abstract:Hierarchical heterostructures fabricated from several optoelectronic materials with different physical properties are the basis for the integration of multifunctional and high-performing micro/nanodevices. Compared with one-component systems, heterostructures with programmable geometries can effectively control device performance, integrate multiple functions, and generate specific applications. However, patterning high-quality hierarchical heterostructures still faces difficulties in regard to solution processing, such as the dissolution of prepared structures during multiple processes and the uncontrollable assembly behaviors of different materials. Here, we report a universal method for fabricating cross-stacked P3HT/MAPbBr3 heterostructure arrays with a large area, homogeneous size, precise position, long-range order, and pure crystallographic orientation. The controlled hierarchical dewetting processes are confined by capillary bridges in the sandwich-structured assembly system, yielding bilayer heterostructure arrays with programmable geometries and tunable positional relationships. Our strategy provides a new perspective for the fabrication of high-throughput and high-efficiency hierarchical heterostructures toward integrated optoelectronics.The Supporting Information is available free of charge at https://pubs.acs.org/doi/10.1021/acsmaterialslett.2c00080.Wettability of silicon micropillar templates, morphologies of the CH3NH3PbBr3 1D arrays, P3HT 1D arrays, and microwires, schematic illustration of the lattice Boltzmann method, EDS measurement and crystallographic characterization of an individual MAPbBr3 microwire, optical microscopic image of large-area cross-stacked heterostructure arrays, energy band and charge transfer diagrams, AFM images of microwire arrays fabricated under different pressures, and SEM images of cross-stacked P3HT/MAPbBr3 heterostructure (PDF)This article has not yet been cited by other publications.

Heated Assembly and Transfer of Van der Waals Heterostructures with Common Nail Polish

Tunable Two-Dimensional Interfacial Coupling in Molecular Heterostructures

Reliable Postprocessing Improvement of van der Waals Heterostructures

Ultra-clean assembly of van der Waals heterostructures

Transfer assembly for two-dimensional van der Waals heterostructures

Optimization of Mechanically Assembled Van Der Waals Heterostructure Based On Solution Immersion and Hot Plate Heating

The hot pick-up technique for batch assembly of van der Waals heterostructures

Suspended dry pick-up and flip-over assembly for van der Waals heterostructures with ultra-clean surfaces

Constructing van der Waals heterostructures by dry-transfer assembly for novel optoelectronic device

Scalable heterostructures produced through mechanical abrasion of van der Waals powders

Simultaneous Assembly of van der Waals Heterostructures into Multiple Nanodevices

Layer-by-layer assembly of two-dimensional materials into wafer-scale heterostructures

Ultrasonic delamination based adhesion testing for high-throughput assembly of van der Waals heterostructures

Constructing Slip Stacking Diversity in Van der Waals Homobilayers

Nanoscopic Building Blocks from Polymers, Metals, and Semiconductors

Pick-up and assembling of chemically sensitive van der Waals heterostructures using dry cryogenic exfoliation

Strategy for transferring van der Waals materials and heterostructures

Clean assembly of van der Waals heterostructures using silicon nitride membranes

Hierarchical Confined Assembly of Bilayer Heterostructures with Programmable Patterns

Pick-and-place transfer of arbitrary-metal electrodes for van der Waals device fabrication