Abstract:Printing of electrical circuits and interconnects using isotropic conductive adhesives (ICAs) is of great interest due to their low-temperature processing and compatibility with substrates for applications in sensors, healthcare, and flexible devices. As a lower cost alternative to silver (Ag), copper (Cu)-filled ICAs are desirable but limited by the formation of high-resistivity Cu surface oxides. To overcome this limitation, self-assembled monolayers (SAMs) of octadecanethiol (ODT) have been demonstrated to reduce the oxidation of micrometer-scale Cu powder particles for use in ICAs. However, the deposition and function of the SAM require further investigation, as described in this paper. As part of this work, the stages of the SAM deposition process, which included etching with hydrochloric acid to remove pre-existing oxides, were studied using X-ray photoelectron spectroscopy (XPS), which showed low levels of subsequent Cu oxidation when ODT coated. The treated Cu powders were combined with one- or two-part epoxy resins to make Cu-ICAs, and the effect of the Cu surface condition and weight loading on electrical conductivity was examined. When thermally cured in an inert argon atmosphere, ICAs filled with Cu protected by ODT achieved electrical conductivity up to 20 × 105 S·m-1, comparable to Ag-ICAs, and were used to make a functional circuit. To understand the function of the SAM in these Cu-ICAs, scanning and transmission electron microscopy were used to examine the internal micro- and nano-structures along with the elemental distribution at the interfaces within sections taken from cured samples. Sulfur (S), indicative of the ODT, was still detected at the internal polymer-metal interface after curing, and particle-to-particle contacts were also examined. XPS also identified S on the surface of cured Cu-ICAs even after thermal treatment. Based on the observations, electrical contact and conduction mechanisms for these Cu-filled ICAs are proposed and discussed.

Research progress of interfacial adhesion force of copper plating on Ajinomoto build-up films for chip substrates

Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation

Effect of High-Frequency and High-Density Current on Adhesive Strength of Copper Thin Film

Strong Adhesion of Electroless Plated Copper by Optimizing Lamination Temperature of Epoxy Composite Film for Advanced Chip Packaging Substrates

Adhesion improvement of sputtered Cu films on flexible polymer substrates through the design of metal interlayers

Enhanced adhesion strength between electroplated Cu and ABF substrate with isothermal annealing treatment

The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives

A New Method to Obtain Cu Films with Lower Resistivity and Higher Interface Adhesion on Different Substrates

Super-high interface adhesion through silver/polyimide heterojunction

Rationally design of substrate surface topography toward the improvement of Cu-plated coating adhesion

Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma

A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications

Electronic Interaction of Epoxy Resin with Copper at the Adhered Interface

Characterization and mechanical testing of polydopamine-adhered electroless copper films

Research Of Electroplating Cu On Pretreatment Ceramic Substrates

Electroplated Copper Additives for Advanced Packaging: A Review

An investigation of methods to enhance adhesion of conductive layer and dielectric substrate for additive manufacturing of electronics

Aminosilanization Nanoadhesive Layer for Nanoelectric Circuits with Porous Ultralow Dielectric Film

A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits

Study on the interfacial interactions and adhesion behaviors of variouspolymer-metalinterfaces in nano molding

Effect of surface modification on interfacial microstructures and mechanical properties of continuous CF/Al composites