Hydrogen-included plasma-assisted reactive sputtering for conductivity control of ultra-wide bandgap amorphous gallium oxide

Kosuke TAKENAKA,Hibiki Komatsu,Taichi Sagano,Keisuke Ide,Susumu Toko,Takayoshi KATASE,Toshio Kamiya,Yuichi Setsuhara
DOI: https://doi.org/10.35848/1347-4065/ad364e
IF: 1.5
2024-03-21
Japanese Journal of Applied Physics
Abstract:Abstract Conductivity control of a-Ga 2 O x films by cation/anion off-stoichiometry such as oxygen vacancy formation and hydrogen doping have been achieved by hydrogen-included plasma-assisted reactive sputter deposition system and physical and electrical properties of a-Ga 2 O x films formed by this system have been investigated. The change in resistivity of a-Ga 2 O x thin films deposited by the hydrogen-doped plasma-assisted reactive sputtering was then investigated by changing the H 2 flow rate ratio H 2 /(Ar + H 2 ) . The a-Ga 2 O x thin films with semiconducting properties with a resistivity as low as 10 2 Ωcm was demonstrated using the plasma-assisted reactive sputtering system with addition to H 2 . Along with the low resistivity, the a-Ga 2 O x thin films with high film density and band gap energy of 5.2 g/cm 3 and 4.8 eV were realized. The electrical resistivity of the a-Ga 2 O x thin films can be controlled from 10 2 Ωcm to 10 5 Ωcm by appropriately controlling the amount of hydrogen introduced from the plasma. The results indicate that the hydrogen acts as a shallow donor, which increases the carrier concentration, can be efficiently introduced by using the plasma-assisted reactive sputtering system with addition to H 2 .
physics, applied
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