Resistive Random Access Memory Behaviors in Organic–Inorganic Hybrid Ultra‐Thin Films

Min Ju Kim,Alba Martinez,Jaejoong Jeong,Seongho Kim,Wan Sik Hwang,Byung Jin Cho
DOI: https://doi.org/10.1002/aelm.202200432
IF: 6.2
2022-07-19
Advanced Electronic Materials
Abstract:Resistive random access memory (ReRAM) devices are proposed by consisting of ultra‐thin organic‐inorganic hybrid films prepared via initiated chemical vapor deposition (iCVD) process. The active matrix of hybrid ReRAM (H‐ReRAM) homogeneously consist of organic and inorganic components, which has the potential to precisely control of conducting filament by two different filament dynamics in the hybrid matrix. The H‐ReRAM is one of the alternative candidates to achieve low power memory devices as well as neuromorphic and cognitive computing devices. Resistive random‐access memory (ReRAM) has been considered for future memory devices, because of its low‐power consumption and a high degree of integration. In this study, hybrid (H‐) ReRAM devices are proposed using ultra‐thin ( 104, endurance >106, retention >104 s), which are notable results compared to conventional ReRAM devices. The resistance changes of the conducting filament in the devices are observed under various temperature conditions to prove the heterogenous filament dynamics in the hybrid matrix. The conducting filament composes of a metallic component and oxygen vacancies give unique properties to H‐ReRAM devices, according to the combination of electrode and hybrid material. It has the potential to precise control of conducting filament by two different filament dynamics in the hybrid matrix. The H‐ReRAM is one of the candidates for alternative memory devices as well as neuromorphic and cognitive computing devices.
materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology
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