Investigation of Multi-Level Cell Characteristic in Amorphous Indium-Gallium-Zinc Oxide Thin-Film-Transistor Based 1T-1R Non-Volatile Memory Device

Hyun-Seok Choi,Won-Ju Cho
DOI: https://doi.org/10.1166/jnn.2019.17000
2019-10-01
Abstract:In this work, we have implemented nonvolatile resistive random access memory (ReRAM) cells consisting of one transistor (1T) and one resistor (1R) configuration by integrating a high-performance InGaZnO (IGZO) thin-film-transistor (TFT) and an HfO₂ resistive switching component on a single substrate for system-on-panel (SoP) technology. ReRAM cells with a 1T-1R configuration can reduce undesired crosstalk caused by leakage current between adjacent memory cells. The a-IGZO TFTs used for 1T-1R integration showed excellent electrical characteristics with a high field-effect mobility of 10.8 cm²/V s, a low subthreshold swing of 226 mV/dec and a large on-off current ratio of 9.2 × 107. The 1T-1R integrated memory cells exhibited BRS behavior, uniform distribution of resistance states and operating voltage, stable DC endurance and reliable data retention characteristics. In addition, we obtained MLC characteristics in a 1T-1R integrated memory cell by controlling the driving current with the gate voltage of a-IGZO TFTs. In multi-level operation, it showed a low operating voltage of 1 V, stable endurance and reliable retention characteristics at 85 °C.
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