A Composite Probe With Connected Via for High Sensitivity Measurement of Electromagnetic-Field Components
Lei Wang,Rong Zhou,Chengyang Luo,Zhangming Zhu
DOI: https://doi.org/10.1109/tcsii.2024.3355231
2024-01-01
Abstract:In this work, a new composite probe with high detection sensitivity, which can simultaneously measure the electric-and magnetic-field components, is presented and studied. The proposed probe is composed of a double-loop detection structure, multiple connected via, a pair of strip-lines as transmission part, a row of via fences, and two SMA connectors. First, a double-loop is designed to measure the electric-and magnetic-field components in the presented probe. Second, multiple connected via are introduced into the bottom of the double-loop to enhance the electric-field coupling. Third, different from the traditional differential loops, the multiple connected via are connected by using a connected via instead of the shorted via. Fourth, in order to demonstrate the outstanding advantages of the design, a standard microstrip line is applied to characterize and calibrate the probe. At last, the presented probe is simulated, printed, and measured, which are printed on a four-layer low-loss Rogers printed circuit board to improve the frequency response of the probe. Simulated and measured results indicate the presented probe can not only measure the electric-and magnetic-field components, but also has higher detection sensitivity at electric-and magnetic-field measurement.
engineering, electrical & electronic