Investigation of Multilayer Print Circuit Board Probe with Temperature Compensation for Ultra-Wideband Near-Field Measurement

Tao Song,Panpan Zuo,Yan Li,Mengjun Wang,Zhongqiu Hua,Hongxing Zheng,Er-Ping Li
DOI: https://doi.org/10.1109/temc.2019.2914735
IF: 2.036
2020-01-01
IEEE Transactions on Electromagnetic Compatibility
Abstract:A novel ultra-wide band wireless probe applied to near-field electromagnetic measurement is presented in this paper, in which the probe is built on an FR-4 substrate with three layers. This paper presents both simulation and measurement study of the probe performance affected by various factors including the vias influence and terminal soldering. A temperature compensation circuit is designed to deal with the influence of temperature variation of the printed circuit board substrate. To assess the effectiveness of the proposed probe, the return loss, gain, and radiation pattern are simulated and experimentally tested. Both simulation and measurement demonstrate that the probe working frequency ranges from 3.1 to 10.6 GHz and the gain is greater than -50 dBm. Moreover, the tested results show that the probe has good stability in terms of temperature, and that it is suitable for the electromagnetic interference (EMI) near-field measurement.
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