Characterization of 4H-SiC nMOSFETs in Harsh Environments, High-Temperature and High Gamma-Ray Radiation

Shinichiro Kuroki,Hirofumi Nagatsuma,Milantha de Silva,Seiji Ishikawa,Tomonori Maeda,Hiroshi Sezaki,Takamaro Kikkawa,Takahiro Makino,Takeshi Ohshima,Mikael Östling,Carl Mikael Zetterling
DOI: https://doi.org/10.4028/www.scientific.net/msf.858.864
2016-05-01
Materials Science Forum
Abstract:Characteristics of 4H-SiC nMOSFETs with arsenic-doped S/D and NbNi silicide contacts in harsh environments of high-temperature up to 450°C, and high gamma-ray radiation up to over 100 Mrad, were investigated. At high temperature, field effect mobility increased as proportional to T 3/2 , and threshold voltage was shifted with temperature coefficients of -4.3 mV/K and -2.6 mV/K for oxide thicknesses of 10 nm and 20 nm, respectively. After Co60 gamma-ray exposure of 113 Mrad, the field effect mobility was varied within 8% for oxide thickness of 10 nm, however for 20 nm oxide thickness, this variation was 26%. The threshold voltage shifts were within 6%.
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