Deposition of aluminum on Kapton laminates by electron‐beam evaporation

Dudley M. Sherman
DOI: https://doi.org/10.1116/1.569520
1978-05-01
Journal of Vacuum Science and Technology
Abstract:Aluminum films 10 μm thick have been deposited on the Kapton surface of a laminated substrate consisting of Kapton–Kapton–aluminum foil bonded with a thermosetting adhesive. The processing of the substrates before deposition necessary to obtain reasonably short deposition cycle times and a minimal amount of deposition system contamination was developed. The laminated substrates required bakeouts both at atmosphere and in high vacuum prior to deposition to permit evaporation at a pressure of 0.1 mPa (1×10−6 Torr). The deposited films exhibited a high specular reflectance, resistivity within 5% of that of bulk aluminum, and a strong (111) fiber texture.
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