Plasma-assisted electron beam evaporation of low stress aluminium films for MEMS applications

Shreyas P. Bhat,Khawaja Nizammuddin Subhani,Savitha Purakkat
DOI: https://doi.org/10.1007/s41683-021-00067-4
2021-06-01
ISSS Journal of Micro and Smart Systems
Abstract:Metallization is one of the pivotal steps in microelectronics and microelectromechanical device fabrication. An interesting challenge in metal cantilever fabrication is to produce free-standing beams with minimal deformation following the release. Such deformations are dictated by residual film stress and stress distribution uniformity across the substrate. In this work, aluminium thin film properties were tailored at room temperature by low energy argon plasma-assisted electron beam evaporation, using a hollow cathode end hall ion source. The influence of varying argon pressure for plasma assistance was investigated on residual film stress and stress distribution uniformity of 200 nm thick aluminium films. Improvement in film stress distribution across silicon substrate and densification of the film by ion-induced surface diffusion was observed for the deposition at room temperature. Cantilever beams were fabricated by dry etching technique; beam deformation was minimal for a film with uniform stress distribution across the substrate and low dislocation density, produced by plasma assistance.
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