Fabrication of MEMS components using ultrafine-grained aluminium alloys

Xiao Guang Qiao,Nong Gao,Zakaria Moktadir,Michael Kraft,Marco J Starink
DOI: https://doi.org/10.1088/0960-1317/20/4/045029
2010-03-22
Journal of Micromechanics and Microengineering
Abstract:A novel process for the fabrication of a microelectromechanical systems (MEMS) metallic component with features smaller than 10 µm and high thermal conductivity was investigated. This may be applied to new or improved microscale components, such as (micro-) heat exchangers. In the first stage of processing, equal channel angular pressing (ECAP) was employed to refine the grain size of commercial purity aluminium (Al-1050) to the ultrafine-grained (UFG) material. Embossing was conducted using a micro silicon mould fabricated by deep reactive ion etching (DRIE). Both cold embossing and hot embossing were performed on the coarse-grained and UFG Al-1050. Cold embossing on UFG Al-1050 led to a partially transferred pattern from the micro silicon mould and high failure rate of the mould. Hot embossing on UFG Al-1050 provided a smooth embossed surface with a fully transferred pattern and a low failure rate of the mould, while hot embossing on the coarse-grained Al-1050 resulted in a rougher surface with shear bands.
engineering, electrical & electronic,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
What problem does this paper attempt to address?