Effect of Grain Size on Formability and Deformation Mechanism of High‐Purity Aluminum during Micro‐Embossing Process at Elevated Temperature

Qian Su,Jie Xu,Huan Yu,Lei Shi,Debin Shan,Bin Guo
DOI: https://doi.org/10.1002/adem.201900690
IF: 3.6
2019-08-20
Advanced Engineering Materials
Abstract:<p>Due to high processing efficiency, low manufacturing cost and emissions of carbon dioxide, micro forming attracted considerable attention in the field of micro electro mechanical systems. Thus, micro‐embossing process was carried out for high purity Al of coarse grained (CG) and ultrafine grained (UFG) microstructure at temperature ranging from 373 to 523 K. The interactive effects of grain size and temperature on formability were clarified. The results indicated that UFG pure Al was of better geometrical accuracy and surface quality in comparison with CG pure Al. Meanwhile, with the increasing of temperature, filling behavior of UFG pure Al got optimized and both CG and UFG pure Al reached full filling after embossing process at 523 K. Based on observation on microstructure of the embossed ribs, plastic deformation together with heat effect triggered recrystallization of the CG pure Al and grain growth of the UFG pure Al. Deformation mechanisms of CG and UFG pure Al were clarified, according to the evolution of misorientation angle distribution and kernel average misorientation. It was confirmed that movement inter‐granule for UFG pure Al including grain boundary slide and grain rotation accounted for the excellent formability.</p><p>This article is protected by copyright. All rights reserved.</p>
materials science, multidisciplinary
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