Abstract:Purpose The purpose of this study is to investigate the dynamics of capillary underfill flow (CUF) in flip-chip packaging, particularly in a multi-chip configuration. The study aims to understand how various parameters, such as chip-to-chip spacing (S12), chip thickness (tc) and others, affect the underfill flow process. By using computational fluid dynamics (CFD) simulations and experimental studies, the goal is to provide insights into understanding the dynamics of CUF in heterogeneous electronic packaging. Design/methodology/approach The paper introduces a CFD analysis and experimental study on CUF in a multi-chip configuration, aiming to understand underfill flow dynamics. A 3D geometry models of multi-chip arrangement are created using computer-aided design (CAD) software. After that, the CAD models are meshed and simulated in Ansys Fluent using incompressible and non-Newtonian fluid properties. The study maintains S12 of 2.86 and tc of 22.29 between experimental and simulation data for results validation. Next, a various of S12 values (1.14, 2.86, 5.71, 8.57, 14.29 and 20) which focus on tc of 22.29 have been investigated. Further studies have been conduct using S12 of 5.71 and tc of 8.00, 14.29 and 22.29. Findings Results show a strong correlation between simulation and experiment which validate the correctness and robustness of simulation. Further parameter's studies using simulation for various of S12 indicated that higher S12 values lead to faster flow. This effect is due to large underfill weight from reservoir able to flow into S12 region which contributed to higher mass momentum movement. Furthermore, the effect of various of tc shows that the thicker the chip the faster the underfill to flow in S12 region. Research limitations/implications The intentional exclusion of solder bump pattern arrangements from the experiment and simulation may limit the study's ability to fully understand the impact of solder bump patterns on underfill flow. Therefore, more parameters can be investigated such as solder bump pattern, underfill weight and dispense pattern in the future using CFD. Practical implications The manuscript provides a comprehensive examination of the contributions of CFD to the advancement of knowledge regarding CUF phenomena in heterogeneous electronic packaging assemblies. Moreover, it delineates the utilization of CFD methodologies to assess the influence of chip-to-chip spacing (S12) and the thickness of the chip (tc) on the underfill flow characteristics. Originality/value This paper fulfills an identified need of computational fluid dynamics method to study capillary underfill flow dynamics in heterogenous electronic packaging.

Analysis of encapsulation process in 3D stacked chips with different microbump array

Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package

Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging

Analytical Analysis on the Capillary Pressure of Underfill Flow Meniscus During the Flip-Chip Encapsulation Process

Reliability Simulation of Metal Bump in A Three-Dimensional Chip Stacking Structure

Novel design and reliability assessment of a 3D DRAM stacking based on Cu-Sn micro-bump bonding and TSV interconnection technology

Development of two different molding methods in 2.5D package with 20 μm or less fine bump pitch CoW structure

Stress analysis of "Micro-Bump Bonding" structure for "Chip on glass" packaging

3D Finite Element Simulation Study of Chip Stacking Structure Considering Different Numbers of Stacked Dies and the Effects of Underfill and Intermetallic Compound Layer of Micro joints

Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages

Reliability Study of Fine Pitch Cu-Sn Micro-Bump Structure Electromigration Test by Finite Element Simulation

Electromagnetic Shielding Analysis of Different Grounded Bump Distribution in SiP

Mechanical and Electrical Reliability Assessment of Bump-Less Wafer-on-wafer Integration with One-Time Bottom-Up TSV Filling

Advancements in Semiconductor Packaging: Exploring the Potential of 3D Multi-Die Stacking Technology

A multi-parameter numerical modeling and simulation of the dipping process in microelectronics packaging

Research on the Stress in Stacked Chip Packages

Underfill of flip chip on laminates: simulation and validation

Thermal for 3D stacked modules ?

3D Chip Stack Technology Using Through-Chip Interconnects

Stress Distribution of Stacked Chip Package in Curing Process