Abstract:Wafer level encapsulation is an important packaging process for several components in mobile and high-performance computing applications. In mobile applications, electronic components like application processors, radio-frequency System in Package (RF-SiP) and antenna modules are being manufactured using wafer level fan-out processes. In HPC, wafer level encapsulation is used for chip-on-wafer (CoW) processing and 2.5D / 3D packaging that enables wafer level packaging of processors and high band width memory devices. Although encapsulant materials are currently used in mass production, many pain points remain unresolved. These are predominantly related to lowering the wafer level warpage to enable better handling of wafers during processing, addressing the environmental and EU REACH regulatory compliance, providing better total cost of ownership to the end user by improving throughput and various other factors. In our development, we aim to address these pains and we will present our progress in this research paper. As the structural material in the package, molding compound can cause severe warpage issue during process, becoming the limiting factor to pursue thinner packaging design and causing serious wafer handling issues in the equipment during wafer processing. However, we considered a new material design route to develop ultra-low warpage LCM materials that can dramatically reduce the warpage thereby benefitting various WLP packaging design, such as Fan-in or Fan-out type. We have successfully demonstrated more than 70% improvement in warpage compared to traditional LCM compound. This new type of LCM material is REACH compliant and shows good warpage stability after high temperature annealing process. The polymer relaxation study shows the unique relaxation behavior leading to the warpage stability that is critical in many Fan-out processes. Dynamic Mechanical Analysis is the useful tool to study the relaxation behavior that can differentiate the impact of various chemistry on epoxy molding materials. Another key advantage of our LCM is the excellent gapfilling capability that can lead to the protection of high density structures in semiconductor packages with finer die-to-die or die-to-substrate spacing, meanwhile enabling low-warpage and simpler processing steps. Moreover, the new LCM design can help further shorten the molding time, allowing for increased throughput resulting in lower cost of ownership for the end users.

Development of two different molding methods in 2.5D package with 20 μm or less fine bump pitch CoW structure

Liquid Compression Mold Underfill Optimization with Low Warpage and Narrow Gap Flow

Thermo-mechanical design and optimization of micro copper pillar bump for electrical interconnection in 2.5D IC integration

Simulation Analysis Of The Fine Pitch Micro-Bump Formation With Solder Injection Method

Microscale Underfill Dynamics and Void Formation of High-Density Flip-Chip Packaging: Experiments and Simulations

Wafer level compression molding compounds

Study of Warpage Evolution and Control for Six-Side Molded WLCSP in Different Packaging Processes

Numerical analysis on MUF process for flip chip packaging

Design, Simulation, And Process Development For 2.5d Tsv Interposer For High Performance Processer Packaging

7nm Chip-Package Interaction Study on a Fine Pitch Flip Chip Package with Laser Assisted Bonding and Mass Reflow Technology

High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging

Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components

Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs

Development of Hybrid Bonding Process for Embedded Bump with Cu-Sn/BCB Structure

Fine Pitch and High Density Sn Bump Fabrication

Low Warpage Liquid Compression Molding (LCM) Material for High Density Fan-out and Wafer Level Packaging Applications

Multi-scale Finite Element Simulation of 2.5D Advanced Packaging for Integrated Circuits during Manufacturing Process

Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging

Fabrication of Fine-Pitch Cu-Sn Microbumps Using Electroplating and Wet Seed Layer Etching

Development of Liquid, Granule and Sheet Type Epoxy Molding Compounds for Fan Out Wafer Level Package

Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement.