Aspects of Epitaxial Design and Estimation of 2DEG Mobility in InAlN/AlN/InGaN/GaN High Electron Mobility Transistors

Vikash K. Singh,Digbijoy N. Nath
DOI: https://doi.org/10.1002/pssa.201700757
2017-12-21
physica status solidi (a)
Abstract:In this paper, a epitaxial design of InAlN/AlN/InGaN/GaN high electron mobility transistors (HEMTs), considering the vital aspects related to its device exploration is proposed. Mobility of two dimensional electron gas in the proposed, practically viable structures of InxGa1−xN‐channel (0.1 < x < 0.4) HEMT is estimated. It is shown that 2DEG mobility is predominantly limited by alloy scattering rather than phonon scattering, unlike in conventional GaN‐channel HEMTs. Finally, room temperature mobility of 2DEG in InGaN‐channel HEMT is simulated on the basis of alloy scattering and phonon scattering only. Results are in close proximity with reported experimental results. We observe that, for ns ≈ 2 × 1013 cm−2, mobility drops rapidly from ≈900 to ≈550 cm2 V−1 · s−1 as ‘x’ is increased from 0.1 to 0.2 and thereafter it decreases at a relatively lesser rate. Severe degradation in mobility is predicted for x > 0.3. InGaN‐channel HEMTs are promising for next‐gen high speed devices due to higher electron velocity in alloys such as InGaN. In this work, low‐field, room temperature mobility for viable InGaN‐channel HEMTs is estimated by considering InAlN/AlN/InxGa1‐xN/GaN heterostructures and accounting for alloy and polar LO phonon scattering. Alloy scattering dominates at higher Indium mole‐fraction as expected, and the estimates are in good agreement with reported experimental results.
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