Thermal-conductivity measurement by time-domain thermoreflectance

David G. Cahill

DOI: https://doi.org/10.1557/mrs.2018.209

IF: 5

2018-10-01

MRS Bulletin

Abstract:Abstract

materials science, multidisciplinary,physics, applied

What problem does this paper attempt to address?

Accurate Thermal Conductivity Measurements of Porous Thin Films by Time-Domain Thermoreflectance

Husam M. Walwil,Yunshan Zhao,Yee Kan Koh

DOI: https://doi.org/10.1021/acsami.3c13418

IF: 9.5

2024-01-03

ACS Applied Materials & Interfaces

Abstract:Accurate measurements of the thermal conductivity (κ) of porous thin films are still limited due to challenges to deposit flat and continuous metal transducers on porous samples, a necessity for many thermal measurement techniques for nanostructures. In this paper, we introduce an approach based on time-domain thermoreflectance (TDTR) to accurately and conveniently measure κ of porous thin films by transferring a flat and smooth metal film unto porous samples as the transducer for TDTR...

materials science, multidisciplinary,nanoscience & nanotechnology
Simultaneous Measurement of Thermal Conductivity, Heat Capacity, and Interfacial Thermal Conductance by Leveraging Negative Delay-Time Data in Time-Domain Thermoreflectance

Mingzhen Zhang,Tao Chen,Ao Zeng,Jialin Tang,Ruiqiang Guo,Puqing Jiang

2024-11-24

Abstract:Time-domain thermoreflectance (TDTR) is a widely used technique for characterizing the thermal properties of bulk and thin-film materials. Traditional TDTR analyses typically focus on positive delay time data for fitting, often requiring multiple-frequency measurements to simultaneously determine thermal conductivity and heat capacity. However, this multiple-frequency approach is cumbersome and may introduce inaccuracies due to inconsistencies across different frequency measurements. In this study, we propose a novel solution to these challenges by harnessing the often-overlooked negative delay time data in TDTR. By integrating these data points, we offer a streamlined, single-frequency method that simultaneously measures thermal conductivity, heat capacity, and interface thermal conductance for both bulk and thin-film materials, enhancing measurement efficiency and accuracy. We demonstrate the effectiveness of this method by measuring several bulk samples including sapphire, silicon, diamond, and Si0.992Ge0.008, and several thin-film samples including a 1.76-{\mu}m-thick gallium nitride (GaN) film epitaxially grown on a silicon substrate, a 320-nm-thick gallium oxide ({\epsilon}-Ga2O3) film epitaxially grown on a silicon carbide substrate, and a 330-nm-thick tantalum nitride (TaN) film deposited on a sapphire substrate, all coated with an aluminum (Al) transducer layer on the surface. Our results show that the new method accurately determines the thermal conductivity and heat capacity of these samples as well as the Al/sample interface thermal conductance using a single modulation frequency, except for the Si0.992Ge0.008 sample. This study sheds light on the untapped potential of TDTR, offering a new, efficient, and accurate avenue for thermal analysis in material science.

Materials Science,Other Condensed Matter
Frequency-Dependent Thermal Conductivity in Time Domain Thermoreflectance Analysis of Thin Films

Pernot Gilles,Michel Hélène,Vermeersch Bjorn,Burke Peter,Lu H.,Rampnoux Jean-Michel,Dilhaire Stefan,Ezzahri Younès,Gossard Arthur,Shakouri Ali

DOI: https://doi.org/10.1557/opl.2011.1277

2011-01-01

MRS Proceedings

Abstract:Over the past three decades, ultrashort laser pulses have been demonstrated to be a very powerful tool to investigate materials properties at the nanoscale. A key driving force is the high-time resolution required to study heat transfer across interfaces and in thin films. The Time-Domain Thermoreflectance (TDTR) is now widely used. This optical technique offers an interesting alternative to electrical approaches such as the 3ω method. We present a complete study of the TDTR signals. We investigate the influence of the modulation frequency on the measured signals and we show how this experimental parameter could be set to enhance or reduce the sensitivity to a specific thermal parameter. The dependence of the measured “apparent” thermal conductivity of the thin film as a function of the modulation frequency is discussed. Results are applied to investigate thermal properties of a series of InGaAs samples with embedded ErAs nanoparticles.
Simultaneous Measurement of Thermal Conductivity and Volumetric Heat Capacity of Thermal Interface Materials Using Thermoreflectance

Zeina Abdallah,James W Pomeroy,Nicolas Blasakis,Athanasios Baltopoulos,Martin Kuball

DOI: https://doi.org/10.1021/acsaelm.4c00691

2024-06-27

Abstract:Thermal interface materials are crucial to minimize the thermal resistance between a semiconductor device and a heat sink, especially for high-power electronic devices, which are susceptible to self-heating-induced failures. The effectiveness of these interface materials depends on their low thermal contact resistance coupled with high thermal conductivity. Various characterization techniques are used to determine the thermal properties of the thermal interface materials. However, their bulk or free-standing thermal properties are typically assessed rather than their thermal performance when applied as a thin layer in real application. In this study, we introduce a low-frequency range frequency domain thermoreflectance method that can measure the effective thermal conductivity and volumetric heat capacity of thermal interface materials simultaneously in situ, illustrated on silver-filled thermal interface material samples, offering a distinct advantage over traditional techniques such as ASTM D5470. Monte Carlo fitting is used to quantify the thermal conductivities and heat capacities and their uncertainties, which are compared to a more efficient least-squares method.
Simultaneous Measurement of Thermal Conductivity and Specific Heat in a Single TDTR Experiment

Fangyuan Sun,Xinwei Wang,Ming Yang,Zhe Chen,Hang Zhang,Dawei Tang

DOI: https://doi.org/10.1007/s10765-017-2328-1

2017-01-01

International Journal of Thermophysics

Abstract:Time-domain thermoreflectance (TDTR) technique is a powerful thermal property measurement method, especially for nano-structures and material interfaces. Thermal properties can be obtained by fitting TDTR experimental data with a proper thermal transport model. In a single TDTR experiment, thermal properties with different sensitivity trends can be extracted simultaneously. However, thermal conductivity and volumetric heat capacity usually have similar trends in sensitivity for most materials; it is difficult to measure them simultaneously. In this work, we present a two-step data fitting method to measure the thermal conductivity and volumetric heat capacity simultaneously from a set of TDTR experimental data at single modulation frequency. This method takes full advantage of the information carried by both amplitude and phase signals; it is a more convenient and effective solution compared with the frequency-domain thermoreflectance method. The relative error is lower than 5 % for most cases. A silicon wafer sample was measured by TDTR method to verify the two-step fitting method.
An instrumentation guide to measuring thermal conductivity using frequency domain thermoreflectance (FDTR)

Dylan J Kirsch,Joshua Martin,Ronald Warzoha,Mark McLean,Donald Windover,Ichiro Takeuchi

DOI: https://doi.org/10.1063/5.0213738

2024-10-01

Abstract:Frequency Domain Thermoreflectance (FDTR) is a versatile technique used to measure the thermal properties of thin films, multilayer stacks, and interfaces that govern the performance and thermal management in semiconductor microelectronics. Reliable thermal property measurements at these length scales (≈10 nm to ≈10 μm), where the physics of thermal transport and phonon scattering at interfaces both grow in complexity, are increasingly relevant as electronic components continue to shrink. While FDTR is a promising technique, FDTR instruments are generally home-built; they can be difficult to construct, align, and maintain, especially for the novice. Our goal here is to provide a practical resource beyond theory that increases the accessibility, replicability, and widespread adoption of FDTR instrumentation. We provide a detailed account of unpublished insights and institutional knowledge that are critical for obtaining accurate and repeatable measurements of thermal properties using FDTR. We discuss component selection and placement, alignment procedures, data collection parameters, common challenges, and our efforts to increase measurement automation. In FDTR, the unknown thermal properties are fit by minimizing the error between the phase lag at each frequency and the multilayer diffusive thermal model solution. For data fitting and uncertainty analysis, we compare common numerical integration methods, and we compare multiple approaches for fitting and uncertainty analysis, including Monte Carlo simulation, to demonstrate their reliability and relative speed. The instrument is validated with substrates of known thermal properties over a wide range of isotropic thermal conductivities, including Borofloat silica, quartz, sapphire, and silicon.
Infrared Radiometry Based Steady-State Method for Thermal Conductivity Measurement

Dihui Wang,Heng Ban

DOI: https://doi.org/10.1115/imece2021-73381

2021-11-01

Abstract:Abstract This study develops an infrared radiometry-based steady-state technique (SSIR) that combines the benefits of transient pump technique, steady-state method, and infrared radiometry. The method uses a continuous wave (CW) laser as the pump source and a high-speed infrared camera system to capture temperature-time maps as the probe system. Instead of the thermoreflectance measurement, the advanced infrared camera system eases the theoretical model and experiment. The infrared camera system enables straightforward temperature versus time reading with a good spatial resolution. For demonstration, material with thermal conductivity over two orders of magnitude (1∼150Wm−1K−1) are measured. This technique enables measuring thermal conductivity independently from volumetric heat capacity, and by using reference sample, the sensitivity to most input parameters is effectively reduced. Therefore, SSIR shows lower uncertainty to standard FDTR and TDTR.
Frequency-domain probe beam deflection method for measurement of thermal conductivity of materials on micron length scale

Jinchi Sun,Guangxin Lv,David G. Cahill

DOI: https://doi.org/10.1063/5.0126717

2022-09-21

Abstract:Time-domain thermoreflectance (TDTR) and frequency-domain thermoreflectance (FDTR) have been widely used for non-contact measurement of anisotropic thermal conductivity of materials with high spatial resolution. However, the requirement of high thermoreflectance coefficient restricts the choice of metal coating and laser wavelength. The accuracy of the measurement is often limited by the high sensitivity to the radii of the laser beams. We describe an alternative frequency-domain pump-probe technique based on probe beam deflection. The beam deflection is primarily caused by thermoelastic deformation of the sample surface with a magnitude determined by the thermal expansion coefficient of the bulk material to measure. We derive an analytical solution to the coupled elasticity and heat diffusion equations for periodic heating of a multilayer sample with anisotropic elastic constants, thermal conductivity, and thermal expansion coefficients. In most cases, a simplified model can reliably describe the frequency dependence of the beam deflection signal without knowledge of the elastic constants and thermal expansion coefficients of the material. The magnitude of the probe beam deflection signal is larger than the maximum magnitude achievable by thermoreflectance detection of surface temperatures if the thermal expansion coefficient is greater than 5x10^(-6) /K. The sensitivity to laser beam radii is suppressed when a larger beam offset is used. We find nearly perfect matching of the measured signal and model prediction, and measure thermal conductivities within 6% of accepted values for materials spanning the range of polymers to gold, 0.1 - 300 W/(m K).

Applied Physics
Hassle-free Approach to Thermal Transport Measurements Using Spatial-Temporal Temperature Data

Ding Ding,Kedar Hippalgaonkar

DOI: https://doi.org/10.48550/arXiv.1903.02708

2019-03-07

Abstract:Nanoscale engineering and novel materials have created interesting effects in thermal transport. Thermal conductivity can now be different due to physical and heating sizes. Also, highly anisotropic thermal conductivity can result from unique material composition and geometries. Various experimental methods have been developed to measure these thermal conductivity variations. All of them require varying the physical size of the sample, the heating size or relative positions between heating and detection. Here, we numerically propose a time-domain optical method that uses spatial temporal temperature data to resolve anisotropic and size-dependent thermal conductivity. Our method is hassle-free as it does not vary any experimental parameters and is easily compatible with various methods of measuring temperature in the time domain. This technique can high throughput screening of thermal properties for nanoengineered and novel materials in thermal transport. Also, this technique can be used to identify novel effects in thermal transport within a single experiment.

Materials Science,Mesoscale and Nanoscale Physics
Raman Scattering Characterization of Transparent Thin Film for Thermal Conductivity Measurement

Shuo Huang,Xiaodong Ruan,Jun Zou,Xin Fu,Huayong Yang

DOI: https://doi.org/10.2514/1.40976

2012-01-01

Journal of Thermophysics and Heat Transfer

Abstract:The Raman scattering method is a noncontact and nondestructive method for film thermal conductivity measurement. However, the original Raman scattering method cannot calculate the thermal conductivity of thin transparent films with submicrometer- or nanometer-scale thickness. An analytical heat transfer model has been built to extend the original Raman scattering method to thin transparent films with submicrometer- or nanometer-scale thickness. Experiments were performed using the extended method to measure the thermal conductivity of silicon dioxide films with submicrometer-scale thickness. The interface thermal resistance between the silicon dioxide film and the silicon substrate was also obtained. The experimental results are consistent with reported data.
A high-precision method to measure thermal conductivity of solids using reversible heat flux

Ping Zhang,Bo Shi,Yimin Xuan,Qiang Li

DOI: https://doi.org/10.1088/0957-0233/24/9/095004

IF: 2.398

2013-01-01

Measurement Science and Technology

Abstract:In the thermal conductivity measurement of solids using the traditional steady-state methods, it is observed that the test results differ from their standard values when only one directional heat flux is introduced. Analysis of the results shows that the additive errors are considerable and cannot be ignored. To minimize the additive errors, a high-precision method by alternating the direction of heat flux in steady-state thermal conductivity measurement of solids is proposed. In this method, the additive errors are diminished by using the data corresponding to both forward and reverse heat flux. Meanwhile, a modified thermal instrument is designed and established to measure the thermal conductivity of solids. Simultaneous calibration of the thermal instrument has been processed to improve the measurement accuracy of temperature readings. The thermal conductivities of samples 99.999% standard pure copper and Elkonite copper-tungsten alloy 30W3 are measured and compared with their reference values to verify the accuracy of the method. The results indicate that the processing data well match the reference values.
Using transducerless time-domain thermoreflectance technique to measure in- and cross-plane thermal conductivity of nanofilms

Yanzheng Du,Zhenxing Bo,Weigang Ma,Weihua Wang,Xing Zhang

DOI: https://doi.org/10.1063/5.0167635

IF: 2.877

2023-11-08

Journal of Applied Physics

Abstract:Time-domain thermoreflectance (TDTR) and frequency-domain thermoreflectance techniques have been widely used to measure thermal properties. However, the existence of the metal sensor brings some limitations to the experimental measurement, such as temperature limits, disability to measure low in-plane thermal conductivity, in situ measurement cannot be achieved, etc. This paper proposes a transducerless time-domain thermoreflectance method to measure in- and cross-plane thermal conductivity of nanofilms, in which the optical absorption depth and thermal conductivity tensor are considered to establish a new differential equation that can describe the heat conduction process in multilayer structures. This thermal model can also calculate the effects of spot ellipticity and spot offset distance. Then, the analytical solution and relative deviation of this new model and the surface heat flow boundary model used in conventional TDTR are compared by calculating the phase signals. In terms of experimental measurement, this model is successfully used to derive cross- and in-plane thermal conductivity of PdSi and IrNiTa amorphous alloy nanofilms without a metal sensor.

physics, applied
Simultaneous measurement of in-plane and through-plane thermal conductivity using beam-offset frequency domain thermoreflectance.

D. Rodin,S. Yee

DOI: https://doi.org/10.1063/1.4973297

IF: 1.6

2017-01-03

Review of Scientific Instruments

Abstract:Transient thermoreflectance (TTR) techniques are ubiquitous methods for measuring thermal conductivity of bulk materials and thin-films. Both through-plane thermal conductivity k⊥ and in-plane thermal conductivity k∥ should be independently measured in transversely anisotropic materials. When these properties are measured using conventional TTR techniques, the accuracy of the k∥ measurement is dependent on the accuracy of measuring k⊥ and vice versa. This is especially problematic for thin-films measurements as uncertainty in k⊥ (∼5%) can propagate and grow for uncertainty in k∥. In this paper, we present a method for the simultaneous measurement of k⊥ and k∥ using beam-offset frequency domain thermoreflectance (FDTR) with robust uncertainty estimation. The conventional diffusive heat transfer solution is analyzed to show that offset and heating frequency can independently control the sensitivity to directional thermal conductivity and extract values for k∥ and k⊥. Numerical uncertainty analyses demonstrate that sweeping both heating frequency and beam offset results in a reduction of measurement uncertainty. This modified measurement technique is demonstrated on crystalline alumina (c-Al2O3), amorphous alumina (a-Al2O3), quartz, fused silica, and highly oriented pyrolytic graphite.

Medicine,Physics,Materials Science
Time-domain thermoreflectance (TDTR) measurements of anisotropic thermal conductivity using a variable spot size approach

Puqing Jiang,Xin Qian,Ronggui Yang

DOI: https://doi.org/10.1063/1.4991715

2017-04-08

Abstract:It is challenging to characterize thermal conductivity of materials with strong anisotropy. In this work, we extend the time-domain thermoreflectance (TDTR) method with a variable spot size approach to simultaneously measure the in-plane (Kr) and the through-plane (Kz) thermal conductivity of materials with strong anisotropy. We first determine Kz from the measurement using a larger spot size, when the heat flow is mainly one-dimensional along the through-plane direction, and the measured signals are sensitive to only Kz. We then extract the in-plane thermal conductivity Kr from a second measurement using the same modulation frequency but with a smaller spot size, when the heat flow becomes three-dimensional, and the signal is sensitive to both Kr and Kz. By choosing the same modulation frequency for the two sets of measurements, we can avoid potential artifacts introduced by the frequency-dependent Kz, which we have found to be non-negligible, especially for some two-dimensional layered materials like MoS2. After careful evaluation of the sensitivity of a series of hypothetical samples, we provided a guideline on choosing the most appropriate laser spot size and modulation frequency that yield the smallest uncertainty, and established a criterion for the range of thermal conductivities that can be measured reliably using our proposed variable spot size TDTR approach. We have demonstrated this variable spot size TDTR approach on samples with a wide range of in-plane thermal conductivity, including fused silica, rutile titania (TiO2 [001]), zinc oxide (ZnO [0001]), molybdenum disulfide (MoS2), hexagonal boron nitride (h-BN), and highly ordered pyrolytic graphite (HOPG).

Materials Science
Comparison of the 3ω Method and Time-Domain Thermoreflectance for Measurements of the Cross-Plane Thermal Conductivity of Epitaxial Semiconductors

Yee Kan Koh,Suzanne L. Singer,Woochul Kim,Joshua M. O. Zide,Hong Lu,David G. Cahill,Arun Majumdar,Arthur C. Gossard

DOI: https://doi.org/10.1063/1.3078808

IF: 2.877

2009-01-01

Journal of Applied Physics

Abstract:The 3ω technique and time-domain thermoreflectance (TDTR) are two experimental methods capable of measuring the cross-plane thermal conductivity of thin films. We compare the cross-plane thermal conductivity measured by the 3ω method and TDTR on epitaxial (In0.52Al0.48)x(In0.53Ga0.47)1−xAs alloy layers with embedded ErAs nanoparticles. Thermal conductivities measured by TDTR at low modulation frequencies (∼1 MHz) are typically in good agreement with thermal conductivities measured by the 3ω method. We discuss the accuracy and limitations of both methods and provide guidelines for estimating uncertainties for each approach.
Thermal Emissivity Measurement with Two-temperature Method

Yunbin Ying,Qiang Li,Sandeep Kaur,Pintu Ghosh

DOI: https://doi.org/10.1088/1742-6596/2002/1/012056

2021-01-01

Journal of Physics Conference Series

Abstract:Thermal emissivity is one of the most important indices used to evaluate thermal emission capability of an object and is essential for characterization of thermal emitters, especially in the field of infrared thermal emission engineering for various applications, including personal thermal management, radiative cooling and heat preservation, infrared stealth, and infrared encryption. However, due to the natural background thermal emissions from the ambient environment and experimental setup, conventional methods generally ignore the background emissions while keeping the temperature of the radiating sample significantly higher than the ambient temperature. Here, we introduce a simple method that enables accurate measurement of emissivity of a given sample without necessitating high temperature through elimination of background emission noise by the difference of the measured emission signals of the sample at two different temperatures.
Thermal Characterization of Carbon Nanotube Fiber by Time-Domain Differential Raman

Changzheng Li,Shen Xu,Yanan Yue,Bing Yang,Xinwei Wang

DOI: https://doi.org/10.1016/j.carbon.2016.03.003

IF: 10.9

2016-01-01

Carbon

Abstract:Most conventional Raman thermometry for thermal properties measurement is on steady-state basis, which utilizes either Joule heating effect or two lasers configurations coupled with increased complexity of system or measurement uncertainty. In this work, a new comprehensive approach including both transient and steady-state Raman method is proposed for thermal properties measurement of micro/nanowires. The transient method employs a modulated (pulsed) laser for transient heating and Raman excitation, and is termed time-domain differential Raman. The average elevated temperature during the transient heating period is probed simultaneously based on Raman thermometry. Thermal diffusivity can be readily determined by fitting normalized temperature rise against heating time with a transient heat conduction model. On the other hand, thermal conductivity can be obtained in the steady-state measurement by adjusting modulation settings. To verify this method, a carbon nanotube (CNT) fiber is measured with the thermal diffusivity of 1.74(-0.20)(+0.20) x 10(-5) m(2)/s and the thermal conductivity of 34.3(-0.4)(+0.4) W/m K. The relatively low thermal transport values stem from numerous CNT-glue matrix and CNT-CNT thermal contact resistances. Compared with the conventional steady-state Raman method, the transient method requires no detailed laser absorption value and no temperature coefficient calibration. It can be easily applied to study transient thermal transport in materials. (C) 2016 Elsevier Ltd. All rights reserved.
Simultaneous measurement of cross-plane thermal conductivity and interfacial thermal conductance of nano-metal films on a low thermal diffusivity substrate using TDTR

Yantao Zeng,Lin'an Li,Shibin Wang,Fangyuan Sun,Zhiyong Wang,Xinhao Tu,Chuanwei Li

DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2024.125542

IF: 5.2

2024-04-18

International Journal of Heat and Mass Transfer

Abstract:The thermal transport properties are very significant for the performance, reliability, and service life of nano-electronic devices. However, effectively measuring the thermal transport properties of nano-metal films is a challenge job, especially for the interfacial thermal conductance between nano-metal films and substrate with low thermal diffusivity. In this study, we improve the traditional time-domain thermoreflectance (TDTR) technique to simultaneously measure cross-plane thermal conductivity and interface thermal conductance of film/substrate assembly with an improved measurement sensitivity. By capturing the reflected beams from the film side and substrate side, and fitting the captured signals with thermal transport models, we simultaneously measure the cross-plane thermal conductivity of Al film, Cr film and SiO2 substrate, as well as the interfacial thermal conductance of Al/Cr and Cr/ SiO2 interfaces. The experimental results show that the interfacial thermal conductance of Al/Cr interface is much larger than that of Cr/ SiO2 interface, and the cross-plane thermal conductivity of Al film and Cr film is much smaller than their corresponding bulk value. Furthermore, we use the Monte Carlo method to analyze the uncertainty of measured parameters and obtain the corresponding error range.

engineering, mechanical,thermodynamics,mechanics
Development of Fourier Transform Ultrafast Laser Flash Method for Simultaneous Measurement of Thermal Diffusivity and Interfacial Thermal Resistance

Takahiro Baba,Tetsuya Baba,Takao Mori

DOI: https://doi.org/10.1007/s10765-023-03324-w

2024-02-03

International Journal of Thermophysics

Abstract:The thermoreflectance technique is one of the few methods which can measure thermal diffusivity of thin films as thin as 100 nm or thinner in the cross-plane direction. The thermoreflectance method under rear-heat front-detect configuration is sometimes called ultrafast laser flash method because of its similarity to laser flash method. Up to now it has typically only been possible to attempt to evaluate the interfacial thermal resistance between the thin films by preparing and measuring several samples with different thicknesses. In this study, a method to directly determine interfacial thermal resistance by a single measurement of a thin film on substrate is represented, by analyzing the shape of thermoreflectance signals with analytical solutions in frequency domain and time domain. Thermoreflectance signals observed from metallic thin films on sapphire substrate with different thickness steps were analyzed by Fourier analysis and fitted by analytical equations with four parameters: heat diffusion time across the first layer, ratio of virtual heat sources, characteristic time of cooling determined by interfacial thermal resistance and relative amplitude of the signal. Interface thermal resistance between the thin film and substrate was able to be determined reliably with smaller uncertainty.

thermodynamics,mechanics,chemistry, physical,physics, applied
IODP Expedition 363 Thermal Conductivity

Yair Rosenthal,Ann Holbourn,Denise K. Kulhanek,Ivano W. Aiello,Tali L. Babila,Germain Bayon,Luc Beaufort,Samantha C. Bova,Jong Hwa Chun,Haowen Dang,Anna Joy Drury,Tom Dunkley Jones,Patrícia P.B. Eichler,Kelly A. Gibson,Robert G. Hatfield,Daniel L. Johnson,Yuho Kumagai,Tiegang Li,Braddock K. Linsley,Niklas Meinicke,Gregory S. Mountain,Bradley N. Opdyke,Paul N. Pearson,Christopher R. Poole,Ana Christina Ravelo,Takuya Sagawa,Allan G. Salazar Fernando,Anne‐Désirée Schmitt,Jennifer B. Wurtzel,Jian Xu,Masanobu Yamamoto,Yige Zhang

DOI: https://doi.org/10.5281/zenodo.10520387

2018-01-01

Abstract:Thermal conductivity was measured using the heated needle method in either full-space needle configuration (soft/saturated sediments) or half-space needle configuration (harder materials) of a TeKa Berlin TK-04 thermal conductivity meter. Heat is applied to the sample and then thermal equilibrium is sought. The heating and equilibration curve is reduced to derive the thermal conductivity value. Raw data are stored if a user wishes to do off-line or postexpedition reduction.

Thermal-conductivity measurement by time-domain thermoreflectance

Accurate Thermal Conductivity Measurements of Porous Thin Films by Time-Domain Thermoreflectance

Simultaneous Measurement of Thermal Conductivity, Heat Capacity, and Interfacial Thermal Conductance by Leveraging Negative Delay-Time Data in Time-Domain Thermoreflectance

Frequency-Dependent Thermal Conductivity in Time Domain Thermoreflectance Analysis of Thin Films

Simultaneous Measurement of Thermal Conductivity and Volumetric Heat Capacity of Thermal Interface Materials Using Thermoreflectance

Simultaneous Measurement of Thermal Conductivity and Specific Heat in a Single TDTR Experiment

An instrumentation guide to measuring thermal conductivity using frequency domain thermoreflectance (FDTR)

Infrared Radiometry Based Steady-State Method for Thermal Conductivity Measurement

Frequency-domain probe beam deflection method for measurement of thermal conductivity of materials on micron length scale

Hassle-free Approach to Thermal Transport Measurements Using Spatial-Temporal Temperature Data

Raman Scattering Characterization of Transparent Thin Film for Thermal Conductivity Measurement

A high-precision method to measure thermal conductivity of solids using reversible heat flux

Using transducerless time-domain thermoreflectance technique to measure in- and cross-plane thermal conductivity of nanofilms

Simultaneous measurement of in-plane and through-plane thermal conductivity using beam-offset frequency domain thermoreflectance.

Time-domain thermoreflectance (TDTR) measurements of anisotropic thermal conductivity using a variable spot size approach

Comparison of the 3ω Method and Time-Domain Thermoreflectance for Measurements of the Cross-Plane Thermal Conductivity of Epitaxial Semiconductors

Thermal Emissivity Measurement with Two-temperature Method

Thermal Characterization of Carbon Nanotube Fiber by Time-Domain Differential Raman

Simultaneous measurement of cross-plane thermal conductivity and interfacial thermal conductance of nano-metal films on a low thermal diffusivity substrate using TDTR

Development of Fourier Transform Ultrafast Laser Flash Method for Simultaneous Measurement of Thermal Diffusivity and Interfacial Thermal Resistance

IODP Expedition 363 Thermal Conductivity