Abstract:An accurate temperature analysis of electronic packaging requires an understanding of the thermal-transport parameters of the material. However, studies on the thermal conductivity of intermetallic compounds (IMCs) in micro-interconnect solder joints are scarce, particularly common IMCs forming in Cu-Sn systems, which seriously affect the precise prediction of the temperature field and thermal stress for electronic packaging structures. This work proposes a novel method to quantitatively measure the thermophysical parameters of Cu-Sn IMCs based on the dual-wavelength femtosecond laser timedomain thermoreflectance (TDTR) system. Cu-Sn diffusion couple samples were prepared using a reflow and aging process. Two layers of Cu6Sn5 and Cu3Sn IMCs formed at the interface with micron thickness, and the (001) crystal plane of Cu6Sn5 was the preferred orientation. The sensitivity of the experimental parameters to the measurement parameters affects the fitting accuracy. Therefore, before testing, the effects of the aluminum transducer thickness and pump laser modulation frequency on the phase signal sensitivity in the thermal conductivity measurements of Cu6Sn5 and Cu3Sn were analyzed to help select the specific experimental parameters. After testing, the thermal conductivities of Cu6Sn5 and Cu3Sn were 47.4 and 87.6 W/(m center dot K), respectively, which are slightly higher than the previous results because of the microstructure discrepancy caused by different material preparation techniques. Finally, the influence of the pump laser diameter, aluminum transducer thickness, and material specific heat on the measurement error of thermal conductivity for Cu6Sn5 and Cu3Sn was examined. The test errors of the Cu6Sn5 and Cu3Sn thermal conductivity were -6.8%similar to 4.6% and -7.1%similar to 4.4%, respectively. Overall, the TDTR technology can evaluate the thermal-transport characteristics of micron-scale intermetallic compounds in electronic packaging and guide the thermal design and reliability evaluations of electronic components.

Simultaneous measurement of cross-plane thermal conductivity and interfacial thermal conductance of nano-metal films on a low thermal diffusivity substrate using TDTR

Simultaneous Measurement of Thermal Conductivity, Heat Capacity, and Interfacial Thermal Conductance by Leveraging Negative Delay-Time Data in Time-Domain Thermoreflectance

Using transducerless time-domain thermoreflectance technique to measure in- and cross-plane thermal conductivity of nanofilms

Ultrafast Thermoreflectance Techniques for Measuring Thermal Conductivity and Interface Thermal Conductance of Thin Films

Simultaneous measurement of thermal conductivity and heat capacity of bulk and thin film materials using frequency-dependent transient thermoreflectance method.

Simultaneous Measurement of Thermal Conductivity and Specific Heat in a Single TDTR Experiment

Thermal Visualization of Buried Interfaces by Transient and Steady-State Responses of Time-Domain Thermoreflectance

Measurements of electron-phonon coupling factor and interfacial thermal resistance of metallic nano-films using a transient thermoreflectance technique

Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance

Analysis of Simplified Heat Transfer Models for Thermal Property Determination of Nano-Film by TDTR Method

Simultaneous Measurement of Thermal Conductivity and Volumetric Heat Capacity of Thermal Interface Materials Using Thermoreflectance

Measurement of the Thermal Transport Properties of Dielectric Thin Films Using the Micro-Raman Method

Simultaneous measurement of in-plane and through-plane thermal conductivity using beam-offset frequency domain thermoreflectance.

Thermal Conductivity Imaging at Micrometre-Scale Resolution for Combinatorial Studies of Materials

Measurement of Thermal Boundary Conductance Between Metal and Dielectric Materials Using Femtosecond Laser Transient Thermoreflectance Technique

Prediction and Measurement of Thermal Transport Across Interfaces Between Semiconductor and Adjacent Layers

Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures

Pump-probe measurements of the thermal conductivity tensor for materials lacking in-plane symmetry.

Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System

Interface thermal conductance and the thermal conductivity of multilayer thin films

Nano-metal film thermal conductivity measurement by using the femtosecond laser pump and probe method