Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Dongliang Zhao,Xin Qian,Xiaokun Gu,Saad Ayub Jajja,Ronggui Yang

DOI: https://doi.org/10.1115/1.4034605

2016-08-27

Abstract:Thermal conductivity and interfacial thermal conductance play crucial roles in the design of engineering systems where temperature and thermal stress are of concerns. To date, a variety of measurement techniques are available for both bulk and thin film solid-state materials with a broad temperature range. For thermal characterization of bulk material, the steady-state absolute method, laser flash diffusivity method, and transient plane source method are most used. For thin film measurement, the 3{\omega} method and transient thermoreflectance technique including both frequency-domain and time-domain analysis are employed widely. This work reviews several most commonly used measurement techniques. In general, it is a very challenging task to determine thermal conductivity and interface contact resistance with less than 5% error. Selecting a specific measurement technique to characterize thermal properties need to be based on: 1) knowledge on the sample whose thermophysical properties is to be determined, including the sample geometry and size, and preparation method; 2) understanding of fundamentals and procedures of the testing technique and equipment, for example, some techniques are limited to samples with specific geometrics and some are limited to specific range of thermophysical properties; 3) understanding of the potential error sources which might affect the final results, for example, the convection and radiation heat losses.

Materials Science

What problem does this paper attempt to address?

The problem that this paper attempts to solve is the crucial role of thermal conductivity and interfacial thermal conductance in the design of engineering systems, especially in terms of temperature and thermal stress. Specifically, the paper aims to review and compare various measurement techniques for characterizing the thermal conductivity and interfacial thermal conductance of solid materials (including bulk materials and thin - film materials). These techniques are of great significance for ensuring that the measurement error is less than 5%, and the selection of a specific measurement technique needs to be based on an understanding of sample characteristics, the principle of the test technique and its potential error sources.

### Main objectives of the paper:
1. **Review measurement techniques**: Introduce multiple techniques currently available for measuring the thermal conductivity and interfacial thermal conductance of bulk materials and thin - film materials.
2. **Technique classification**: Classify these techniques into steady - state methods and transient methods, and describe in detail the principle, advantages and disadvantages, and application scope of each method.
3. **Error analysis**: Discuss potential sources of error that affect measurement results, such as convective and radiative heat losses.
4. **Application examples**: Provide a guide for the selection of measurement techniques in different materials and application scenarios.

### Specific issues:
- **Bulk materials**: Mainly discussed steady - state methods (such as absolute techniques, comparison methods, radial heat flow methods, and parallel thermal conductance methods) and transient methods (such as pulsed - power techniques, hot - wire methods, transient plane - source methods, and laser - flash diffusion methods).
- **Thin - film materials**: Focused on introducing the steady - state electrical heating method, the 3ω method, and the transient thermoreflectance technique (including time - domain and frequency - domain analysis).

### Key formulas:
- **Fourier's law of heat conduction**:
\[
k=\frac{Q \cdot L}{A \cdot \Delta T}
\]
where \(k\) is the thermal conductivity, \(Q\) is the heat passing through the sample, \(L\) is the sample length, \(A\) is the cross - sectional area, and \(\Delta T\) is the temperature difference.

- **Transient measurement of thermal conductivity** (for example, the 3ω method):
\[
k = \frac{\pi \cdot I_0^2 \cdot \omega \cdot d}{\Delta T_{pp} \cdot \ln(2)}
\]
where \(I_0\) is the current amplitude, \(\omega\) is the frequency, \(d\) is the film thickness, and \(\Delta T_{pp}\) is the peak - to - peak value of the temperature signal.

### Conclusion:
Through this review paper, the author hopes to provide researchers and engineers with a comprehensive reference to help them select appropriate measurement techniques to accurately characterize the thermal properties of materials when designing and optimizing thermal management systems.