Enhanced adhesion of copper plating to polyether ether ketone based on active oxygen species generated under ultraviolet irradiation

Munenori Yoshida,Gaku Nakanishi,Hiromi Yamanaka,Satoru Iwamori
DOI: https://doi.org/10.1002/sia.7088
2022-03-20
Surface and Interface Analysis
Abstract:Surface and Interface Analysis, Accepted Article.
chemistry, physical
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