Key issues and challenges in device level fabrication of MEMS acoustic sensors using piezo thin films doped with strontium and lanthanum

M. Kathiresan,C. Manikandan,S. Premkumar,E. Varadarajan,R. Ramesh,M. K. Jayaraj,T. Santhanakrishnan
DOI: https://doi.org/10.1007/s10854-022-08102-2
2022-03-31
Abstract:The development of next-generation piezoelectric micro-electro-mechanical systems (piezo-MEMS) demands reliable and reproducible processes to fulfil the ever-growing requirements. Research on doped PZT thin films with improved ferroelectric and piezoelectric thin films is on the rise; however, most of them mainly discuss the fabrication process flows and results. This paper attempts to present an overview of some of the key issues and challenges encountered in the device level fabrication of piezo-MEMS acoustic sensors using PZT thin films doped with Strontium and Lanthanum for underwater applications. A recipe on the technical challenges would have saved more time and cost for the researchers as several unsuccessful fabrications and damages were encountered. This paper discusses the issues starting from fabrication of sputtering target to deposition, annealing, patterning and isolation of device layers, electrical contacts, packaging as per the application requirements, etc. in detail.
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
What problem does this paper attempt to address?