Preparation of Germanium Nitride Films by Low Pressure Chemical Vapor Deposition

Andrew B. Young,James J. Rosenberg,Istvan Szendro
DOI: https://doi.org/10.1149/1.2100303
IF: 3.9
1987-11-01
Journal of The Electrochemical Society
Abstract:Germanium nitride (Ge3N4) was deposited onto polished germanium wafers by low pressure chemical vapor deposition (LPCVD). Depositions were performed in a hot‐wall quartz tube system at temperatures from 450° to 600°C, using GeCl4 and NH3 reactants. Details of the deposition procedure and apparatus are reported here. Deposition rates of 5–50 Å per min were obtained, yielding films having refractive indexes of 2.05±0.05 , as measured by ellipsometry. The dependence of deposition rate on temperature and gas flow parameters is reported. Infrared transmission data, as well as etch rate data, are also presented.
electrochemistry,materials science, coatings & films
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