Abstract:An unusual dot pattern was realized via self-assembly of high molecular weight polystyrene-block-polydimethylsiloxane (PS-b-PDMS) copolymer by a simple one-step solvent annealing process, optimized based on Hansen solubility parameters. Annealing PS-b-PDMS under neutral solvent vapors at room temperature produces an ordered arrangement of dots with ∼112 nm spacing and ∼54 nm diameter. The template is highly resistant to dry etching with chlorine-based plasma, enabling its utilization on a variety of hard masks and substrates. The self-assembled PDMS dots were further exploited as a template for direct patterning of silicon, metal, and dielectric materials. This nanopatterning methodology circumvents expensive and time-consuming atomic layer deposition, wet processes, and sequential infiltration techniques. Application-wise, we show a process to fabricate nanostructured antireflection surfaces (nanocones) on a 2 in. silicon wafer, reducing the reflectance of planar silicon from 35% to below 0.5% over a broad wavelength range. Alternatively, nanocones made of TiO2 on silicon exhibit low reflectance (<3%) and improved transmittance into the substrate at the visible wavelength range. The measured optical properties concur with the simulation results. The versatility of the PS-b-PDMS templates was further utilized for nanopatterning materials such as silicon-on-insulator substrates, gallium arsenide, aluminum indium phosphide, and gallium nitride, which are important in electronics and photonics.

Polymeric mask protection for alternative KOH silicon wet etching

A spin-on photosensitive polymeric etch protection mask for anisotropic wet etching of silicon

Graphene Masks As Passivation Layers in the Electrochemical Etching of Silicon

Research on Metal Protection in KOH Wet Etching Process

Maskless Etching Of Three-Dimensional Silicon Structures In Koh

Maskless Anisotropic Etching-a Novel Micromachining Technology for Multilevel Microstructures

Study on maskless etching of silicon symmetric beam-mass structure in aqueous KOH

Improved PECVD SixNy film as a mask layer for deep wet etching of the silicon

Novel masked-mask-free etching technology for silicon multilevel microstructures

Dry etching of polydimethylsiloxane used for bio-microfluidic systems

Protein-resistant polymer coatings on silicon oxide by surface-initiated atom transfer radical polymerization

Selective etching of PDMS: etching as positive resist

New silicon hard mask material development for sub-5nm node

Method for Fabricating Micro/Nanostructures Via Scanning Probe Microscope and Anisotropic Wet Etching

High molecular weight block copolymer lithography for nanofabrication of hard mask and photonic nanostructures

A New Release Process in Surface Micromachining-Double Mask Technology

A high-yield fabrication process for silicon neural probes

Galvanic etch stop for Si in KOH

Large-Area Preparation of a Robust Superamphiphobic Coating for Chemical Mechanical Polishing Application

Implementation of high‐performance, freestanding flexible film masks through photosensitive polyimide for arbitrary surface micropatterns creation

SU8 etch mask for patterning PDMS and its application to flexible fluidic microactuators