Wafer-to-wafer temperature distribution control in a diffusion furnace

Ikuo Matsuba,Kinji Mokuya,Kuniaki Matsumoto,Akira Yoshinaka

DOI: https://doi.org/10.1002/ecjb.4420750709

1992-01-01

Abstract:Abstract A control scheme to achieve wafer‐to‐wafer temperature uniformity in the reaction tube used for oxidation, diffusion, or annealing during semiconductor processes is proposed. In the analytical model, self‐radiation loss, radiation between neighboring wafers, radiation from the tube wall, and thermal diffusion on a wafer surface are taken into account. The temperature monitoring points were the inlet, middle, and outlet of the reaction tube. The analysis indicates that if the tube wall temperatures at the inlet and outlet are 6 percent higher than that at the center of the tube, the wafer‐to‐wafer temperature becomes uniform. In the experiment, taking the silica tube temperature as the tube wall temperature, the increase in the temperatures at the inlet and outlet must be 5.6 percent to achieve wafer‐to‐wafer temperature uniformity, while it should be 6.9 percent if the temperature of the secondary tube is considered to be the tube wall temperature. Experiment results verify the effectiveness of the model. At the same time, the tube wall temperature is assumed to be influenced not only by the temperature of the silica tube but also by that of the secondary tube. The model predicts that the wafer temperature increased by 1°C if the tube wall temperature is increased as described in the foregoing. However, in the experiment, the wafer temperature increases by 1.6°C at most.