Abstract:We report on the cure characterization, based on inline monitoring of the dielectric parameters, of a commercially available epoxy phenol resin molding compound with a high glass transition temperature (>195 °C), which is suitable for the direct packaging of electronic components. The resin was cured under isothermal temperatures close to general process conditions (165–185 °C). The material conversion was determined by measuring the ion viscosity. The change of the ion viscosity as a function of time and temperature was used to characterize the cross-linking behavior, following two separate approaches (model based and isoconversional). The determined kinetic parameters are in good agreement with those reported in the literature for EMCs and lead to accurate cure predictions under process-near conditions. Furthermore, the kinetic models based on dielectric analysis (DEA) were compared with standard offline differential scanning calorimetry (DSC) models, which were based on dynamic measurements. Many of the determined kinetic parameters had similar values for the different approaches. Major deviations were found for the parameters linked to the end of the reaction where vitrification phenomena occur under process-related conditions. The glass transition temperature of the inline molded parts was determined via thermomechanical analysis (TMA) to confirm the vitrification effect. The similarities and differences between the resulting kinetics models of the two different measurement techniques are presented and it is shown how dielectric analysis can be of high relevance for the characterization of the curing reaction under conditions close to series production.

A new approach for determination of gel time of a glass/epoxy prepreg

Studies on Cure Kinetics of Diglycidyl Ether of 4,4′-Bisphenol/4,4′-diaminobiphenyl Using the Advanced Isoconversional Method

Cure Kinetics of an Epoxy Resin Containing Naphthyl/dicyclopentadiene Moieties and Bis‐phenoxy (3‐hydroxy) Phosphine Oxide System and Properties of Its Cured Polymer

Rheological Behaviors and Structural Transitions in A Polyethersulfone-Modified Epoxy System During Phase Separation

Model-Fitting and Model-Free Nonisothermal Curing Kinetics of Epoxy Resin with A Low-Volatile Five-Armed Starlike Aliphatic Polyamine

Gel point determination of a thermoset prepreg by means of rheology

A comparison of gel point for a glass/epoxy composite and a neat epoxy material during isothermal curing

Determination of gel point and completion of curing in a single fiber/polymer composite

Dielectric and rheological study of the molecular dynamics during the cure of an epoxy resin

Investigation of the curing behaviour of carbon fibre epoxy prepreg by Dynamic Mechanical Analysis DMA

Dynamic Mechanical Analysis (DMA) of epoxy carbon-fibre prepregs partially cured in a discontinued autoclave analogue process

Dielectric cure determination of a thermosetting epoxy composite prepreg

In Situ Monitoring of the Curing of a Bisphenol-A Epoxy Resin by Raman-Spectroscopy and Rheology

Gelation Behavior of Thermoplastic-Modified Epoxy Systems During Polymerization-Induced Phase Separation

Exploring Gel-Point Identification in Epoxy Resin Using Rheology and Unsupervised Learning

Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis

Thermo-rheological and kinetic characterization and modeling of an epoxy vitrimer based on polyimine exchange

Isothermal Curing Kinetics of A Flame Retardant Epoxy Resin Containing Dopo Investigated by Dsc and Rheology

Cure kinetics, glass transition temperature development, and dielectric spectroscopy of a low temperature cure epoxy/amine system

Carbon-fibre epoxy prepreg (CFC) curing in an autoclave analogue process controlled by Dynamic Mechanical Analysis (DMA)

Spectroscopic and Rheological Cross-Analysis of Polyester Polyol Cure Behavior: Role of Polyester Secondary Hydroxyl Content