A 72-Channel Resistive-and-Capacitive Sensor-Interface Chip With Noise-Orthogonalizing and Pad-Sharing Techniques
Xiangdong Feng,Yuxuan Luo,Tianyi Cai,Yangfan Xuan,Yunshan Zhang,Yili Shen,Changgui Yang,Qijing Xiao,Sijun Du,Bo Zhao
DOI: https://doi.org/10.1109/jssc.2023.3344587
IF: 5.4
2024-02-27
IEEE Journal of Solid-State Circuits
Abstract:The growing trend of the Internet of Things (IoT) involves trillions of sensors in various applications. An extensive array of parameters need to be gathered concurrently with high-precision, low-cost, and low-power sensor nodes, such as resistive (R) and capacitive (C) sensors. Single-chip channel fusion can be an effective solution, while it is challenging to suppress the noise and integrate massive I/O pads. However, conventional oversampling noise-shaping methods increase power consumption, which fails to meet the demand of long-term monitoring applications. In addition, existing R/C sensor-interface chips require a pair of I/O pads for each sensor, where the pad frame dominates the overall chip area in massive-channel integration. In this work, we demonstrate a 72-channel R&C sensor-interface chip for proximity-and-temperature sensing. A noise-orthogonalizing technique is proposed to eliminate the quantization noise at the signal frequencies, achieving an energy efficiency of 19.1 pJ/step/channel. Moreover, a pad-sharing technique is proposed to reduce the number of I/O pads by half, enabling 72 sensors to be read by 36 pairs of I/O pads. The chip is fabricated by 65-nm CMOS technology, and measurement results show resolutions of 286 and 162 fF, respectively. The power consumption and die area are reduced to 0.74 /Channel and 0.038 mm2/Channel, respectively.
engineering, electrical & electronic