A novel crack-free Ti-modified Al-Cu-Mg alloy designed for selective laser melting

Jinliang Zhang,Jianbao Gao,Bo Song,Lijun Zhang,Changjun Han,Chao Cai,Kun Zhou,Yusheng Shi
DOI: https://doi.org/10.1016/j.addma.2020.101829
IF: 11
2021-02-01
Additive Manufacturing
Abstract:<p>A novel crack-free Ti-modified Al-Cu-Mg alloy for SLM was developed here, based on the thermodynamic calculations of the crack susceptibility index and growth-restriction factor. We found that the introduction of Ti into the Al-Cu-Mg alloy effectively promoted the grain refinement and columnar-to-equiaxed grain transition as a result of the heterogeneous nucleation provided by Al<sub>3</sub>Ti precipitates. The hot tearing cracks were eliminated after Ti modification due to the formation of the homogeneous and fine equiaxed microstructure. We created a new high-strength Al-Cu-Mg-Ti alloy with a tensile strength of 426.4 MPa, yield strength of 293.2 MPa and ductility of 9.1%. This novel Ti-modified Al alloy with fine equiaxed grains and highly-enhanced mechanical properties offers a new compositional space for the printable lightweight material categories specifically for the SLM technique.</p>
engineering, manufacturing,materials science, multidisciplinary
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