Curing behaviors and mechanical properties of SiC-whisker-reinforced alumina ceramics fabricated with digital light processing

Mingze Xin,Zhanqiang Liu,Bing Wang,Jinfu Zhao,Yukui Cai,Qinghua Song
DOI: https://doi.org/10.1016/j.jmrt.2023.07.016
IF: 6.267
2023-07-09
Journal of Materials Research and Technology
Abstract:Silicon carbide whiskers (SiC w ) have presented great potential to improve the mechanical properties of Al 2 O 3 ceramic. However, effective curing of SiC w /Al 2 O 3 ceramic slurry during digital light processing (DLP) is still challenged due to the high refractive index of SiC w . This paper aims to investigate the effect of SiC w content on rheological properties and associated curing behaviors of ceramic slurry. A modified Beer-Lambert model is proposed to evaluate the curing depth as functions of SiC w content and exposure parameters. The SiC w /Al 2 O 3 ceramic slurries with the whiskers content of 0 to 16 vol.% are prepared and characterized. The results indicate that the curing depth decreased from 158 to 19 μm at the given exposure energy of 100 mJ/cm 2 with the increase of SiC w content. The scattering and absorbance of light result in the decrease of curing depth and the geometrical overgrowth. The rheological properties of ceramic slurry are affected by the agglomerated whiskers. Furthermore, SiC w /Al 2 O 3 ceramics are fabricated by DLP method, based on which the relationships among mechanical properties, microstructures and whiskers contents are determined. Significant effect of reinforcement is obtained in SiC w /Al 2 O 3 ceramic due to whiskers pullout consuming the external loading energy. The microhardness and flexural strength of the SiC w /Al 2 O 3 ceramics with 8 vol.% SiC w are 16.72 GPa and 208.5 MPa, respectively.
materials science, multidisciplinary,metallurgy & metallurgical engineering
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