Silicon carbide whiskers reinforced SiOC ceramics through digital light processing 3D printing technology

Jinhua Yang,Ran Yu,Xinpan Li,Yangyang He,Lei Wang,Wei Huang,Jian Jiao

DOI: https://doi.org/10.1016/j.ceramint.2021.03.152

IF: 5.532

2021-07-01

Ceramics International

Abstract:Polymer derived silicon oxycarbide ceramic materials and silicon carbide whiskers reinforced ceramic composite are prepared through digital light processing (DLP) 3D printing technology in the present work. A new type of UV-curable preceramic polymer is firstly synthesized and then two types of photopolymer resins with and without SiC whiskers as reinforcement are prepared. Due to the high curing rate and good fluidity of the resins, they are applied in DLP 3D printing and various 3D objects with complicated structures and high printing resolution have been printed. The derived ceramic materials show amorphous microstructure and there is no apparent porosity and cracking throughout the whole sample surface of the ceramic materials and the SiC whiskers are uniformly embedded in the ceramic matrix and remain intact and unaffected during the pyrolysis process. The SiC whiskers reduced the shrinkage and mass loss. More importantly, it significantly improves the mechanical performance of the derived ceramic materials in which the compressive strength increases from 77.5 ± 10.2 MPa to 98.4 ± 12.3 MPa. Benefiting from the easiness of the fabrication, high printing resolution and excellent mechanical performance, the derived ceramic materials have great potential applications in various areas.

materials science, ceramics

What problem does this paper attempt to address?

The main problem that this paper attempts to solve is how to prepare SiOC ceramic materials with enhanced mechanical properties through digital light processing (DLP) 3D printing technology, and use SiC whiskers as reinforcing materials to improve their properties. Specifically, the research objectives include:

1. **Develop new UV - curable precursor polymers**: Synthesize a new UV - curable precursor polymer for DLP 3D printing technology.
2. **Prepare photosensitive resins containing SiC whiskers**: Prepare two types of photosensitive resins, one without SiC whiskers and the other with SiC whiskers as reinforcing materials.
3. **Improve the ability to 3D - print complex structures**: Due to the high curing rate and good fluidity, these resins can be applied to DLP 3D printing, enabling the printing of 3D objects with complex structures and high resolution.
4. **Reduce shrinkage and mass loss during the sintering process**: The addition of SiC whiskers reduces the shrinkage and mass loss of the material during the sintering process.
5. **Significantly improve mechanical properties**: In particular, the compressive strength is increased from 77.5 ± 10.2 MPa to 98.4 ± 12.3 MPa.

### Specific problems and solutions

- **How to uniformly disperse SiC whiskers and maintain suspension stability**:
- Using BYK - 410 as a dispersant solves the problem that SiC whiskers are difficult to be uniformly dispersed in the photosensitive resin, so that the mixture can remain stable for several weeks.

- **How to ensure the effectiveness of the UV - curing process**:
- A two - stage curing system is adopted. First, UV curing is carried out, and then high - temperature post - curing is carried out to ensure the complete conversion of acrylate groups.

- **How to verify the performance improvement of the material**:
- The composition and microstructure of the material are characterized by means such as XRD, XPS, and SEM, and at the same time, a compression test is carried out to evaluate the mechanical properties.

### Conclusion

Thanks to easy manufacturing, high printing resolution, and excellent mechanical properties, the prepared SiOC - SiC w composite ceramic materials have broad application potential in multiple fields.