Influence of Etching Trench on Keff2 of Film Bulk Acoustic Resonator

Chao Gao,Yang Zou,Jie Zhou,Yan Liu,Wenjuan Liu,Yao Cai,Chengliang Sun
DOI: https://doi.org/10.3390/mi13010102
IF: 3.4
2022-01-08
Micromachines
Abstract:As radio-frequency (RF) communication becomes more ubiquitous globally, film bulk acoustic resonators (FBAR) have attracted great attention for their superior performance. One of the key parameters of an FBAR, the effective electromechanical coupling coefficient (Keff2), has a great influence on the bandwidth of RF filters. In this work, we propose a feasible method to tune the Keff2 of the FBAR by etching the piezoelectric material to form a trench around the active area of the FBAR. The influence of the position of the etching trench on the Keff2 of the FBAR was investigated by 3D finite element modeling and experimental fabricating. Meanwhile, a theoretical electrical model was presented to test and verify the simulated and measured results. The Keff2 of the FBAR tended to be reduced when the distance between the edge of the top electrode and the edge of the trench was increased, but the Q value of the FBAR was not degraded. This work provides a new possibility for tuning the Keff2 of resonators to meet the requirements of different filter bandwidths.
chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
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