Enhancing Metal Impurity Removal in Diamond Wire-Sawing Silicon Kerf-Loss through Sonifier-Assisted Acid Leaching Process

M. Bharathwaj,P. Karuppasamy,P. Ramasamy
DOI: https://doi.org/10.1007/s12633-024-03001-z
IF: 3.4
2024-05-10
Silicon
Abstract:The silicon kerf which is diamond wire-saw silicon powder (DWSSP) is obtained from a diamond wire saw machine. The DWSSP contains metallic impurities originating from the growth and cutting processes. Initially, the DWSSP was analyzed to determine its average particle size, which was 1.8 μm. Elemental analysis revealed the presence of silicon (Si) at a weight% of 52.05%, oxygen (O) at 42.24%, carbon (C) at 4.72%, and other elements. The metal impurities aluminium (Al) and iron (Fe) were identified in the prepared sample at a concentration of 9.45 parts per million (ppm) and 18.35 ppm, respectively. To purify the DWSSP, sulfuric acid (H 2 SO 4 ) was used as a leaching agent due to its very strong and inorganic reagent. In dilute solutions the hydrogen sulfate ions also dissociate, forming more hydrogen ions (H + ) and sulfate ions (SO 4 2− ). Therefore, the metal impurities can easily be removed from the DWSSP. The many leaching conditions have been optimized, considering a temperature of 80 °C, a leaching duration of 60 min, an acid concentration of 15%, a liquid-to-solid ratio of 100 ml/5 g exposed to the sonifier with 40 kHz frequency, and 150 W power. Under this optimized condition, the metal impurities are removed by 99.98%, resulting in a DWSSP purity of 99.62%. The leaching process was regulated using the homogeneous reaction model, and the activation energy for Al and Fe was determined to be 24.24 kilojoules per mole (kJ/mol) and 15.99 kJ/mol, respectively.
materials science, multidisciplinary,chemistry, physical
What problem does this paper attempt to address?