Melting Behavior of Diamond Wire Saw Silicon Powder after Acid Leaching Treatment during Recycling Process

Qiannuo Bao,Jijun Wu,Kuixian Wei,Wenhui Ma,Wu, Jijun,Wei, Kuixian
DOI: https://doi.org/10.1007/s12633-024-02890-4
IF: 3.4
2024-03-05
Silicon
Abstract:The low temperature acid leaching technology can effectively remove multiple impurity elements in the monocrystalline diamond wire saw silicon powder (DWSSP). However, the DWSSP after acid leaching suffers from the refractory problem, which affects the melting process of pyrorefining. In this study, two different waste diamond wire saw DWSSP sources are used as raw materials. The melting behavior of DWSSP after acid leaching is first studied. High temperature melting experiments for DWSSP treated under different acid leaching conditions are then conducted in a vacuum induction melting furnace. Afterwards, the impacts of the oxygen content and silicon oxide layer distribution in the DWSSP particles on their melting effect are studied, and the corresponding mechanism is explained. The obtained results show that the acid leaching treatment makes the surface of waste DWSSP rough and porous, and the surface area of the silicon oxide layer becomes larger, which causes the refractory of acid leaching DWSSP. In addition, when the oxygen content is reduced from 4.18 to 1.2%, the DWSSP is melted to an ingot containing a small amount of slag. When it continues to decrease to 0.8%, the DWSSP is melted to a complete ingot without slag. After prolonging the stirring time, the oxygen content in the silicon powder increases again because the oxidation rate is higher than the deoxidation rate, and the slag layer forms again on the surface of the silicon ingot.
materials science, multidisciplinary,chemistry, physical
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