Research on Removing Silicon and Silicon Dioxide from the Cutting Waste Slurry of Silicon Wafer

Si-yi HOU,Sheng-nian TIE,Chang-an WANG
DOI: https://doi.org/10.16553/j.cnki.issn1000-985x.2013.07.039
2013-01-01
Abstract:The silicon, silicon dioxide and other impurities were removed from waste mortars using alkali washing method. The effects of the type and concentration of alkali solution, the ratio of alkali solution and total silicon, reaction time, reaction temperature on the result of removing impurities were studied. The best processing technology was obtained by the orthogonal experiment. The optimized process has high recovery efficiency.
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