Abstract:Thermal issue is becoming more and more serious when integrated circuits (IC) further explores along the road of More Moore with dramatic increments of integration degree and power density. Thermal management, including thermal design, modeling, and optimization, has been an important concern in the system-level design of 3D IC. Current thermal modeling for a system level 3D IC design usually relies on a simplified thermal resistance network, which requires trade-offs between the model complexity and the simulation accuracy. Comparing to traditional thermal resistance based model, finite element simulation can provide a more accurate simulation for the thermal management of 3D IC. However, a full chip scale numerical simulation is still lack as an unacceptable huge grid number is unavoidable to deal with the geometric size mismatch existed in a 3D IC. Moreover, current finite element method based numerical simulation tools have no direct supports for the thermal management of 3D IC, since the placement design usually consists a complex data structure from a 3D IC. A method to bridge the finite element method and the 3D IC placement is introduced in this work. The whole bridge process includes placement data structure extraction, 3D IC system model generation, structure, mesh, solver configuration, calculation, and post data analysis. A full chip scale numerical simulation was demonstrated based the present bridge method along with the recently reported equivalent thermal conductivity simplified model.

MORE-Stress: Model Order Reduction Based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC

Modeling Simplification for Thermal Mechanical Stress Analysis of TSV Interposer Stack

Thermal Stress and Reliability Analysis of TSV-Based 3-D ICs with a Novel Adaptive Strategy Finite Element Method

System-Level Analysis of 3D ICs with Thermal TSVs

Comprehensive study of the impact of TSV induced thermo-mechanical stress on 3D IC device performance

Finite Element Stress Analysis Of 3d Tsv Stack Subject To Large Temperature Loading

An Analytical Model of Thermal Mechanical Stress Induced by Through Silicon Via

An Effective Approach for Thermal Performance Analysis of Three-Dimensional Integrated Circuits with Through-Silicon Vias

Lumped 3-D Equivalent Thermal Circuit Model for Transient Thermal Analysis of TSV Array

A Universal and Efficient Equivalent Modeling Method for Thermal Analysis of 3D ICs Containing Tapered TSVs

Thermal–Mechanical Performance Analysis and Structure Optimization of the TSV in 3-D IC

An Inter-Scale Simulation Method for TSV 3D IC Based on Linear Superposition Algorithm and TSV Model Sharing Strategy

An Effective Approach for Thermal Performance Analysis of 3-D Integrated Circuits with Through-Silicon Vias

3D Package Thermal Analysis and Thermal Optimization

A Full Chip Scale Numerical Simulation Method for Thermal Management of 3D IC

The thermal stress analysis in 3D IC integration with TSV interposer

Electrical-Thermal Co-Simulation For Through Silicon Via And Active Tier In 3-D Ic

The Thermal Stress Analysis for IC Integrations with TSV Interposer by Complement Sector Models

3D Tcad Modeling for Stress Management in Through Silicon Via (tsv) Stacks

Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array

A Finite Element Simulation for 3D-IC under Thermal Loads