Close Atomic Surface on Aluminum Alloy Using Green Chemical Mechanical Polishing with Synergistic Effect Between Yttria and Silica Abrasives

Zeyun Wang,Zhenyu Zhang,Hongxiu Zhou,Dong Han,Chunjing Shi,Leilei Chen,Jian Yao,Shiqiang Yu,Jianan Xu
DOI: https://doi.org/10.1016/j.apsusc.2024.161586
IF: 6.7
2025-01-01
Applied Surface Science
Abstract:Parts made of aluminum (Al) alloys widely used by optical systems in aerospace industry strictly require surface roughness (Sa) not exceeding 0.5 nm. However, since Al alloys are soft-plastic metals, indentations, scratches, abrasion, as well as corrosion occur easily. Therefore, achieving close atomic surface on Al alloys is a challenge for traditional chemical mechanical polishing (CMP). To address the challenge, a novel green CMP method is proposed herein, utilizing silica, yttria, serine, hydrogen peroxide and deionized water which allows achieving a Sa of 0.245 nm over a measurement area of 100 x 100 mu m2. To the best of our knowledge, this is the lowest surface roughness of a close atomic surface achieved for an Al alloy over such a large scanning area. Yttria works synergistically with silica by improving its dispersion, which was confirmed by tribological experiments. X-ray photoelectron spectroscopy and Fourier transform infrared spectroscopy revealed that an oxide layer containing alumina and Al(OH)3 formed on the Al alloy oxidized by hydrogen peroxide. Serine dissolved the oxidized layer, chelating and removing the Al ions. The proposed CMP method offers a new approach to obtaining close atomic surfaces for the optical systems used by aerospace industry.
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