Atomic Surface on Fused Silica Induced by Novel Green Photochemical Mechanical Polishing

Chunjing Shi,Zhenyu Zhang,Leilei Chen,Qiyuan Li,Hongxiu Zhou,Shenghua He,Jie Liu,Qingxiong Wang,Shiqiang Yu
DOI: https://doi.org/10.1016/j.surfin.2024.105253
IF: 6.2
2024-01-01
Surfaces and Interfaces
Abstract:Photochemical mechanical polishing (PCMP) exhibits excellent photochemical properties for polishing diverse materials from alloys to resins and quartz. However, comprehensive research on large atomic surfaces, slurry reusing, and post-treatments is rare and challenging. Thus, we have designed Prussian blue and cerium oxide (PB-CeO2) composites and subsequently developed reusable, neutral, and environmentally friendly PCMP slurries. Enhanced with photocatalysis, the developed slurries can own more active species, which not only boost CMP efficiency but also eliminate the need for pH regulators that might cause excessive etching. The slurry only consists of water, composite abrasives, sodium carboxymethylcellulose and hydrogen peroxide, without any other additives. Atomic surfaces of fused silica are achieved with surface roughness of 0.113 nm at measurement areas of 100 x 100 mu m(2), and the MRR is 34.920 mu m/h, which was performed by developed recycled slurry of PCMP. These are unprecedented results for atomic surfaces at large areas for such a high MRR through reused PCMP. X-ray photoelectron, Fourier transform infrared and Raman spectra reveal that designed composite abrasives generate active species (e(-), h(+) and center dot OH), under simulated solar irradiation. The active species weaken Si-O bonds, forming Si-O-Ce bridges and facilitating the extraction of additional silicon ions. Our proposed cleaner polishing method and recycled slurry effectively reduce the manufacturing cost and save energy, promoting environmental protection and ecological benefit.
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