Abstract:Electrically conductive epoxy adhesive, which combines with Ag sintering materials rather than traditional Pb-based solder materials, attracts wide research interest in modern die attach technology for power electronic packaging owing to its advantages of low processing temperature and high working temperature. In this work, Cu foil and AgNO3 were used as raw materials to synthesize dendritic silver nanostructure with a central trunk of 5–10 μm along with many primary branches of 200 nm. Subsequently, the sintering behavior of the obtained dendritic Ag nanostructures, as low-temperature interconnect material, was systematically investigated under different sintering conditions. Remarkably, the shear strength of the interconnect joints formed from dendritic Ag nanostructures could reach around 21 MPa after sintering for 30 min at 250 °C under a pressure of 10 MPa, whereas the shear strengths of the interconnect joints, which formed from Ag microspheres and microflakes under similar conditions, were only 9 MPa and 11 MPa. We think that the dramatic increment in the shear strength may result from the higher contact area of nanoscale primary branches of the synthesized dendritic structures than Ag microstructures and the low-temperature sintering of their nanoscale primary branches. In addition, the interconnect joint formed from dendritic Ag nanostructures also exhibited high reliability, and it still maintained a high shear strength of 27 ± 2 MPa even after 1000 cycles thermal quenching between − 55 and 125 °C. The thermal resistance and electrical conductivity of these interconnect joints were about 78.89 Wm−1 K−1 and 9.85 × 10–6 Ω cm, respectively, which makes its further interconnect applications feasible. This means that the synthesized special dendritic Ag nanostructure has an excellent potential as a high-performance die attach material for high- and low-temperature power device.

Microstructure Optimization of Magnetron-Sputtered Silver Films for Low-Temperature Interconnection

Interface Enhancing Strategy for Low-Temperature Bonding of Ag-based Nanoalloy

Effects of technological parameters in magnetron sputtering process on properties of metallized films

Effects of High-Temperature Treatment on the Reaction Between Sn-3%Ag-0.5%Cu Solder and Sputtered Ni-V Film on Ferrite Substrate

Heterogeneous Bonding with Nanostructured Silver Langmuir-Blodgett Film

Synergistic size and shape effect of dendritic silver nanostructures for low-temperature sintering of paste as die attach materials

Low-Temperature Sintering of Nanoscale Silver Pastes for High-Performance and Highly-Reliable Device Interconnection

Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

Low Temperature Sintering of Silver Nanoparticle Paste for Electronic Packaging

Mechanical Properties and Microstructure of Low Temperature Sintered Joints Using Organic-Free Silver Nanostructured Film for Die Attachment of SiC Power Electronics

Mechanism of Low Temperature Sintering-Bonding Through In-Situ Formation of Silver Nanoparticles Using Silver Oxide Microparticles

Low Temperature Sintered Silver Nanoflake Paste for Power Device Packaging and Its Anisotropic Sintering Mechanism

Low-Temperature-Sintered Nano-Ag Film for Power Electronics Packaging

Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles

Construction of Microstructures on the Cu Substrate Using Ultrafast Laser Processing to Enhance the Bonding Strength of Sintered Ag Nanoparticles

Optimized bimodal silver particle sintering for high thermal conductivity die-attach layers

Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections

Enhanced Tunability Performance of Low Temperature Crystallized Pb0.4sr0.6tio3 Thin Films Derived from Distinct Microstructure

Atomic Insights into the Sintering Behaviour of Ag-Cu Solid Solution Nanoparticles on Ag Substrate

Comparison of the Resistivities of Nanostructured Films Made from Silver, Copper-Silver and Copper Nanoparticle and Nanowire Suspensions

Effects of Oxygen Content on Low-Temperature Bonding Using Organic-Free Silver Nanostructured Film with Different Types of Substrate Metallization