Comparison of the Resistivities of Nanostructured Films Made from Silver, Copper-Silver and Copper Nanoparticle and Nanowire Suspensions

Boris Polyakov,Aleksandrs Novikovs,Madara Leimane,Kevon Kadiwala,Martins Zubkins,Edgars Butanovs,Sven Oras,Elyad Damerchi,Veronika Zadin,Sergei Vlassov

DOI: https://doi.org/10.1016/j.tsf.2023.140087

2023-10-19

Abstract:Spray deposition and inkjet printing of various nanostructures are emerging complementary methods for creating conductive coatings on different substrates. In comparison to established deposition techniques like vacuum metal coating and lithography-based metallization processes, spray deposition and inkjet printing benefit from significantly simplified equipment. However, there are number of challenges related to peculiar properties and behaviour of nanostructures that require additional studies. In present work, we investigate electroconductive properties and sintering behaviour of thin films produced from nanostructures of different metals (Ag, Cu and Cu-Ag) and different shapes (nanowires and spherical nanoparticles), and compare them to the reference Ag and Cu magnetron deposited films. Synthesized nanostructures were studied with transmission electron microscopy. Morphology and crystallinity of produced metal films were studied with scanning electron microscopy and X-ray diffraction. The electrical parameters were measured by the van der Pauw method. All nanowires-based films provided high conductivity and required only modest thermal treatment (200 C). To achieve sufficient sintering and conductivity of nanoparticles-based films, higher temperatures are required (300 C for Ag nanoparticles and 350 C for Cu and Cu-Ag nanoparticles). Additionally, stability of nanowires was studied by annealing the samples in vacuum conditions inside a scanning electron microscope at 500 C.

Applied Physics,Materials Science