Preparation Of High-Performance Conductive Ink With Silver Nanoparticles And Nanoplates For Fabricating Conductive Films

Xiaojian Yang,Wei He,Shouxu Wang,Guoyun Zhou,Yao Tang
DOI: https://doi.org/10.1080/10426914.2012.709344
IF: 4.7832
2012-01-01
Materials and Manufacturing Processes
Abstract:A novel preparation method for a high-performance conductive ink which consisted of silver nanoplates, spherical silver nanoparticles, and epoxy resin was developed. Silver nanoparticles and nanoplates were synthesized via chemical reduction method in the presence of poly (vinyl pyrrolidone) (PVP). The prepared silver ink exhibited a remarkable electrical, thermal stability, and mechanical properties, which were confirmed by the four-point probe method, thermogravimetric analysis (TGA), and the three-point bending testing. We demonstrated the influence of sintering temperatures and time on the electrical resistivity. After sintering at 150 degrees C for 15 min, the conductive film was able to achieve the volume electrical resistivity of (3-4) x 10(-5)O . cm.
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