Abstract:Micro-electro-mechanic-system (MEMS) devices on flexible substrate are important for non-planar and non-rigid surface applications. In this paper, a novel and cost-effective fabrication process for an 8×8 MEMS temperature sensor array with a lateral dimension of 2.5mm×5.5mm on a polyimide flexible substrate is developed. A 40μm thick polyimide substrate is formed on a rigid silicon wafer using as a mechanical carrier throughout the fabrication by four successive spin coating liquid polyimide. The arrayed temperature sensing elements made of 1200Å sputtered platinum thin film on polyimide substrate show excellent linearity with a temperature coefficient of resistance of 0.0028/°C. The purposed sensor obtains a high sensitivity of 0.781Ω/°C at 8mA at constant drive current. Because of the low heat capacity and excellent thermal isolation, the temperature sensing element shows excellent high sensitivity and a fast thermal response. The finished devices are flexible enough to be folded and twisted achieving any desired shape and form. Employing spin-coated liquid polyimide substrate instead of solid polyimide sheet minimizes the thermal cycling as well as improves the production yield. This fabrication technique first introduces the spin-coated PDMS (Polydimethylsiloxane) interlayer between the silicon carrier and the polyimide substrate and makes the polyimide-based devices separate much easier and greatly simplifies the fabrication process with a high production yield. A non-successive two-stage cure procedure for the polyimide precursor is developed to meet low-temperature requirement of the PDMS interlayer. The fabrication procedure developed in this research is compatible with conventional MEMS technology through an optimized integration process. The novel flexible MEMS technology can benefit the development of other new flexible polyimide-based devices.

Flexible MEMS-IC Microsystem by a Wafer-Level F-eSiFO Integration Process

Microfluidic Channel-Based Soft Electrodes and Their Application in Capacitive Pressure Sensing

Development of Wafer Level Process for the Fabrication of Advanced Capacitive Fingerprint Sensors Using Embedded Silicon Fan-Out (esifo(r)) Technology

A Polymer-Based Embedded Silicon Fan-Out Packaging (P-Esifo) Method for High-Density Chiplet Packaging

Flexible Electronics: Ultrathin Silicon Circuits with Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper (adv. Mater. 36/2009)

Parylene-MEMS Technique-Based Flexible Electronics

Flexible Integrated Circuits Via Stress-minimized Layout and Ultra-thin Chip

Facial Fabrication of Paper-Based Flexible Electronics with Flash Foam Stamp Lithography

Stretchable and Foldable Silicon Integrated Circuits

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Complementary Metal Oxide Silicon Integrated Circuits Incorporating Monolithically Integrated Stretchable Wavy Interconnects

Silicon-Based Stretchable Structure Via Parylene Kirigami Interconnection

Flexible in-plane micro-supercapacitors: Progresses and challenges in fabrication and applications

Post-CMOS and Post-MEMS Compatible Flexible Skin Technologies: A Review

High-density Embedded Silicon Fan-out (H-Esifo) Process for a CMOS Operational Amplifier

Design and fabrication of MEMS devices using the integration of MUMPs, trench-refilled molding, DRIE and bulk silicon etching processes

A molded surface-micromachining and bulk etching release (MOSBE) fabrication platform on (1 1 1) Si for MOEMS

Design and Manufacture of a High Precision MEMS Flexible Force Sensor

Stretchable silicon array with stretchability at 66.1% ± 2.9% and silicon areal coverage of 71.5% enabled by wafer-level microfabrication strategy

A Novel Fabrication Process of MEMS Devices on Polyimide Flexible Substrates

A Novel Fabrication Method for Flexible SOI Substrate Based on Trench Refilling with Polydimethylsiloxane