Abstract:High-performance stretchable electronics are attracting great attention due to the mechanical adaptability, but are still limited to achieving highly-integrable, high density, high-performance stretchable silicon-based electronics. This paper proposed a Parylene Kirigami structure as a stretchable interconnection to connect silicon (Si) units in an array. The equivalent Young’s modulus and stretchability model of the Parylene Kirigami were developed and verified numerically and experimentally. As a preliminary demonstration, a Parylene Kirigami structure-based stretchable Si array (Parylene KiSS array) was successfully fabricated by the wafer-scale microelectromechanical systems (MEMS) process with a high Si areal coverage of 68.8 % and the stretchability of 31.0 ± 1.1%. The equivalent Young’s modulus of this Parylene KiSS array was 130.88 ± 6.75 MPa, which was estimated precisely by the proposed model and was around 1000 times smaller than that of the intrinsic silicon. This MEMS process compatible stretchable electronics strategy can integrate Si-based high-performance chiplets, sensors and actuators to realize high-performance stretchable microsystems. [2022-0157]

Silicon-Based Stretchable Structure Via Parylene Kirigami Interconnection