Wafer-scale Integration of Stretchable Semiconducting Polymer Microstructures Via Capillary Gradient

Yuchen Qiu,Bo Zhang,Junchuan Yang,Hanfei Gao,Shuang Li,Le Wang,Penghua Wu,Yewang Su,Yan Zhao,Jiangang Feng,Lei Jiang,Yuchen Wu
DOI: https://doi.org/10.1038/s41467-021-27370-w
IF: 16.6
2021-01-01
Nature Communications
Abstract:Organic semiconducting polymers have opened a new paradigm for soft electronics due to their intrinsic flexibility and solution processibility. However, the contradiction between the mechanical stretchability and electronic performances restricts the implementation of high-mobility polymers with rigid molecular backbone in deformable devices. Here, we report the realization of high mobility and stretchability on curvilinear polymer microstructures fabricated by capillary-gradient assembly method. Curvilinear polymer microstructure arrays are fabricated with highly ordered molecular packing, controllable pattern, and wafer-scale homogeneity, leading to hole mobilities of 4.3 and 2.6 cm2 V-1 s-1 under zero and 100% strain, respectively. Fully stretchable field-effect transistors and logic circuits can be integrated in solution process. Long-range homogeneity is demonstrated with the narrow distribution of height, width, mobility, on-off ratio and threshold voltage across a four-inch wafer. This solution-assembly method provides a platform for wafer-scale and reproducible integration of high-performance soft electronic devices and circuits based on organic semiconductors.
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