Ultrasonic End Fly Cutting of Micro-Structured Surfaces on Single-Crystal Brittle Materials

Peng Huang,Zhiheng Guo,Tianxiao Chang,LiMin Zhu,Zhiwei Zhu
DOI: https://doi.org/10.1016/j.jmapro.2024.02.014
IF: 5.684
2024-01-01
Journal of Manufacturing Processes
Abstract:Although single-crystal optical materials are widely applied in advanced optical systems, it is still challenging for current ultra-precision machining techniques to generate complex optical surfaces on the optical materials with high machining efficiency and high surface uniformity. Targeting improving the machinability, we propose an ultrasonic end fly cutting (UEFC) method for creating micro-structured surfaces on single-crystal brittle materials. In UEFC, an ultrasonic elliptical vibrator that oscillates diamond tools is purposely designed to rotate on the spindle, which is for improving the machinability of brittle materials. Additionally, the constant distance between the vibrator and the spindle axis may enable a constant cutting speed, which is crucial for guaranteeing the process consistency. Taking advantage of servo motions on the workpiece from the slide moving along the spindle axis direction, complex-shaped micro-structured surfaces can be efficiently fabricated. Since only a segment of a quasi-circular path is adopted in the UEFC, the cutting direction may vary within a narrow range, allowing to align the cutting direction to coincide with a specified crystal orientation having a maximum critical depth of cut. Therefore, the constant cutting speed, consistent servo motion, and nearly consistent cutting direction related to the crystal direction in UEFC may guarantee a highly uniform quality of the machined surface with maximized machining efficiency. To verify UEFC, a crack-free micro-lens array with large sags was machined on the single-crystal calcium fluoride. The surface quality uniformity was demonstrated by achieving consistent form error (peak-to-valley) and surface roughness of lenslets in arbitrary positions to be around 0.4 mu m and 5 nm, respectively.
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