Abstract:Single-crystal copper (Cu), whose atom arrangement is in the same direction and has no grain boundary, is widely used in defense technology, civil electronics and network communication. As a diamond machinable material, fan-shaped patterns are commonly generated on the machined surface in single-point diamond turning (SPDT), which affects the machined surface quality and the optical function it carries. Previous studies on the surface generation mechanism in SPDT of single-crystal copper were limited to experimental analyses, while there is a lack of fundamental understanding in the generation mechanism and suppression method of fan-shaped pattern. In the present study, the fan-shaped patterns, surface quality, cutting force and chip morphology generates during SPDT of typical crystal planes (100), (110) and (111) of single-crystal copper were studied both from theoretical and experimental analyses. A molecular dynamics (MD) simulation was conducted to present the fundamental generation mechanism of the fan-shaped patterns from atom arrangement directions and its angle changing with the primary cutting direction in micro scope, while a cutting dynamics model was established to simulate the generation of fan-shaped patterns on the machined surface in macro scope. Based on theoretical and experimental analysis, it was found that the different atom density arrangement directions of single-crystal copper and main cutting direction of SPDT caused fluctuations in the friction coefficient, which further caused the vibration of the cutting system and generated the fan-shaped patterns. The SPDT of crystal planes (100) can achieve the best surface quality. The present research provides a fundamental understanding of fan-shaped pattern formation on the machined surface, and provides a reference to obtain better surface quality in machining of single-crystal copper.

Grain Refinement-Induced Machined Surface Quality Promotion in Ultrasonic Vibration-Assisted Polycrystalline Diamond Cutting of Polycrystalline Cu

Promoted grain refinement in tool-chip interface during ultrasonic elliptical vibration-assisted cutting of polycrystalline copper

Controllable Diamond Cutting of Structured Surfaces with Subnanometric Height Features on Silicon

Generation mechanism and dual-dynamics simulation of surface patterns in single-point diamond turning of single-crystal copper

Influence of Vibration Inclination on Surface Quality and Tool Wear by Ultra-Precision Vibration-Assisted Cutting

Atomistic investigation of machinability of monocrystalline 3C–SiC in elliptical vibration-assisted diamond cutting

Anisotropy-Related Machining Characteristics in Ultra-Precision Diamond Cutting of Crystalline Copper

Theoretical and numerical studies of surface microstructural transformation in ultrasonic elliptical vibration cutting tungsten heavy alloys

Mechanism and feasibility of ultrasonic-assisted milling to improve the machined surface quality of 2D Cf/SiC composites

Study on Electrical Discharge and Ultrasonic-Assisted Mechanical Combined Machining of Polycrystalline Diamond

Surface/subsurface formation mechanism of tungsten during ultrasonic elliptical vibration cutting

Ultrasonic elliptical vibratory nanocutting mechanisms of Cu 50 Zr 50 amorphous alloy: A molecular dynamics simulation

Insight into surface formation mechanism during ultrasonic elliptical vibration cutting of tungsten alloy by scratching experiment and molecular dynamics

Study on the fabrication of micro-textured end face in one-dimensional ultrasonic vibration–assisted turning

The interaction between grain boundary and tool geometry in nanocutting of a bi-crystal copper

Experimental study on surface physical behaviour and integrity of polycrystalline diamond (PCD) in micron-scale abrasive flow assisted impulse-discharge machining

On understanding the cutting mechanism of SiCp/Al composites during ultrasonic elliptical vibration-assisted machining

Molecular simulation of ultrasonic assisted diamond grit scratching 4H-SiC single-crystal

Influence of the grain size of CVD diamond on the thermal conductivity, material removal depth and surface roughness in nanosecond laser machining

Experimental Studies of the Machinability of SiCp/Al with Different Volume Fractions under Ultrasonic-Assisted Grinding

Experimental Study on the Surface Integrity and Chip Formation in the Micro Cutting Process