Promoted grain refinement in tool-chip interface during ultrasonic elliptical vibration-assisted cutting of polycrystalline copper

Wenxin Zhang,Junjie Zhang,Zhanfeng Wang
DOI: https://doi.org/10.1007/s00170-024-14341-w
IF: 3.563
2024-09-10
The International Journal of Advanced Manufacturing Technology
Abstract:While the tool-chip contact behavior plays a dominant role in determining tool-chip friction, the intermittent cutting condition applied by ultrasonic vibration assistance significantly alters the thermomechanical properties of the tool-chip interface, which subsequently affects the microstructure evolution in the chip formation process. In the present work, we elucidate the mechanisms of grain refinement, as well as their dependence on vibration amplitude, in ultrasonic elliptical vibration-assisted cutting (UEVC) of polycrystalline copper by multi-scale numerical simulations. Specifically, two simulation approaches of finite element simulation and cellular automaton are bridged based on the thermomechanical condition of the tool-chip interface, which is subsequently utilized to reveal the tool-chip friction-induced microstructural evolution in the formed chip. Finite element simulation results indicate that the temperature and strain in the tool-chip interface during UEVC are both significantly higher than that during ordinary cutting, due to the high frequent impact of tool on chip, as well as the dominant shear frictional force between tool and chip. Consequently, corresponding cellular automaton simulations demonstrate the promoted grain refinement through dynamic recrystallization in chip during UEVC from ordinary cutting, due to the intensified thermomechanical condition in the tool-chip interface. Subsequent evaluation on the influence of vibration amplitude on grain refinement in chip during UEVC is further conducted, which shows the more pronounced grain refinement for higher amplitude, accompanied with lowered tool-chip contact length and cutting force. At the highest amplitude of 4 μm, the proportion of DRX reaches the highest value of 89.5% accompanied with the lowest average grain size of 81 nm.
engineering, manufacturing,automation & control systems
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