Electronic Properties of A-Sio<inline-formula> ≪tex-Math Notation="latex">${}_{x}$</tex-Math> ≪/inline-Formula>n<inline-formula> ≪tex-Math Notation="latex">${}_{y}$</tex-Math> ≪/inline-Formula>:H/sin<inline-formula> ≪tex-Math Notation="latex">${}_{x}$</tex-Math> ≪/inline-Formula> Stacks for Surface Passivation of P-Type Crystalline Si Wafers

Xuemei Cheng,Halvard Haug,Marisa Di Sabatino,Jiejie Zhu,Erik Stensrud Marstein
DOI: https://doi.org/10.1109/jphotov.2016.2581421
2016-01-01
IEEE Journal of Photovoltaics
Abstract:The surface passivation quality of plasma-enhanced chemical vapor-deposited silicon oxynitride/silicon nitride (a-SiO x N y :H/SiN x ) stacks has been investigated for p-type float-zone crystalline silicon wafers. The effective lifetime τ eff , density of fixed charge Q f , and density of interface defects D it were measured as a function of the a-SiO x N y :H layer thickness both before and after firing at 800°C for 3 s. Photoluminescence imaging under applied bias has been used to characterize Q f and the surface recombination parameters S 0n and S 0p through fitting τ eff versus voltage curves to an extended Shockley-Read-Hall (SRH) model. The results are in good agreement with values measured using capacitance-conductance-voltage measurements. Good surface passivation has been obtained with a peak effective lifetime of 2.41 ms. For both as-deposited and fired samples, Q f and D it decrease with increasing a-SiO x N y :H layer thickness up to ~18 nm. The results indicate that the field-effect passivation is weakened as the a-SiO x N y :H thickness increases and that chemical passivation from a-SiO x N y :H/SiN x plays a prominent role. Increasing the a-SiO x N y :H/SiN x thickness to 50 nm produces similar results, indicating that an 18-nm interlayer is enough to obtain the desired passivation properties. Compared with as-deposited samples, fired samples exhibit lower D it , indicating that the firing process enhances chemical passivation of the a-SiO x N y :H/SiN x stacks.
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