An In0.53Ga0.47As/In0.52Al0.48As Heterojunction Dopingless Tunnel FET with a Heterogate Dielectric for High Performance

Hu Liu,Lin‐An Yang,Zhi Jin,Yue Hao
DOI: https://doi.org/10.1109/ted.2019.2916975
IF: 3.1
2019-01-01
IEEE Transactions on Electron Devices
Abstract:In this paper, an In 0.53 Ga 0.47 As/In 0.52 Al 0.48 As heterojunction dopingless tunnel field-effect transistor (HDL-TFET) with an HfO 2 /SiO 2 heterogate dielectric is proposed, where the N + -pocket with variable electron concentration can be formed by adjusting the length of source-side channel (LSC) based on the charge plasma concept, instead of employing conventional ion implantation or dual-material gate techniques. It aims to improve the device performance and simplify the device fabrication. At the drain bias of 0.3 V, numerical simulations show that the on-state current (ION) of the HDL-TFET with LSC = 4 nm can approach ~10 -5 A/μm that is far higher than that of the Si-DL-TFET (~10 -10 A/μm), and the average subthreshold swing (SS avg ) can approach 36.6 mV/decade that is significantly lower than that of the Si-DL-TFET (89.2 mV/decade). It is also found that the drain-induced barrier lowering (DIBL) effect and the ambipolar current can be effectively suppressed in the HDL-TFET because of an existence of heterojunction. Under the condition of low gate and drain biases, the HDL-TFET exhibits peak values of the cutoff frequency (f T ) and the maximum oscillation frequency (f max ) approaching 13 and 4.73 GHz, respectively, while the Si-DL-TFET yields those of 8.05 and 2.26 GHz, respectively, under relatively higher biases. It indicates that the HDL-TFET is a promising device for low-power consumption radio frequency applications.
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